JPH01161357U - - Google Patents

Info

Publication number
JPH01161357U
JPH01161357U JP5861088U JP5861088U JPH01161357U JP H01161357 U JPH01161357 U JP H01161357U JP 5861088 U JP5861088 U JP 5861088U JP 5861088 U JP5861088 U JP 5861088U JP H01161357 U JPH01161357 U JP H01161357U
Authority
JP
Japan
Prior art keywords
integrated circuit
insulating layer
positioning
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5861088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5861088U priority Critical patent/JPH01161357U/ja
Publication of JPH01161357U publication Critical patent/JPH01161357U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案の一実施例の平面
図および組立断面図、第3図および第4図は従来
の実施例の平面図および組立断面図である。 1……回路基板、2……導体パターン、2a…
…フローテイングパターン、2d……絶縁層の逃
げ、3……絶縁層、3a……絶縁層で形成された
目印、4……チツプ素子、4a……チツプ素子の
電極、2c……配線用導体パターン。
1 and 2 are a plan view and an assembled sectional view of an embodiment of the present invention, and FIGS. 3 and 4 are a plan view and an assembled sectional view of a conventional embodiment. 1... Circuit board, 2... Conductor pattern, 2a...
...Floating pattern, 2d... Escape of insulating layer, 3... Insulating layer, 3a... Mark formed of insulating layer, 4... Chip element, 4a... Electrode of chip element, 2c... Wiring conductor pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路素子を搭載した回路基板において、回
路基板上に絶縁層でチツプ素子の位置決めを示す
目印を設けることを特徴とする集積回路装置。
1. An integrated circuit device on which an integrated circuit element is mounted, characterized in that a mark indicating the positioning of the chip element is provided on the circuit board using an insulating layer.
JP5861088U 1988-04-28 1988-04-28 Pending JPH01161357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5861088U JPH01161357U (en) 1988-04-28 1988-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5861088U JPH01161357U (en) 1988-04-28 1988-04-28

Publications (1)

Publication Number Publication Date
JPH01161357U true JPH01161357U (en) 1989-11-09

Family

ID=31284411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5861088U Pending JPH01161357U (en) 1988-04-28 1988-04-28

Country Status (1)

Country Link
JP (1) JPH01161357U (en)

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