JPH01113378U - - Google Patents
Info
- Publication number
- JPH01113378U JPH01113378U JP865588U JP865588U JPH01113378U JP H01113378 U JPH01113378 U JP H01113378U JP 865588 U JP865588 U JP 865588U JP 865588 U JP865588 U JP 865588U JP H01113378 U JPH01113378 U JP H01113378U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- conductor
- insulating film
- protective insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の部分平面図、第２
図は従来の混成集積回路装置の部分平面図である
。
１……混成集積回路基板、２……導電路、３…
…電極パツド、４……保護絶縁膜、５……凸のあ
る境界線、６……真直な境界線。
Fig. 1 is a partial plan view of one embodiment of the present invention;
The figure is a partial plan view of a conventional hybrid integrated circuit device. 1... Hybrid integrated circuit board, 2... Conductive path, 3...
...electrode pad, 4...protective insulating film, 5...convex boundary line, 6...straight boundary line.
Claims (1)
形成された混成集積回路基板を有する混成集積回
路装置において、前記保護絶縁膜で覆われている
導体と裸状の導体との境界部の境界線が外側に凸
起または内側に凹んだ非直線形となつていること
を特徴とする混成集積回路装置。 In a hybrid integrated circuit device having a hybrid integrated circuit board on which a conductive path conductor is formed partially exposed from a protective insulating film, a boundary line between a conductor covered with the protective insulating film and a bare conductor. 1. A hybrid integrated circuit device characterized by having a non-linear shape that is convex on the outside or concave on the inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP865588U JPH01113378U (en) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP865588U JPH01113378U (en) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113378U true JPH01113378U (en) | 1989-07-31 |
Family
ID=31214725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP865588U Pending JPH01113378U (en) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113378U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269508A (en) * | 2005-03-22 | 2006-10-05 | Hitachi Ltd | Printed-wiring board and method of determining erosion state |
-
1988
- 1988-01-25 JP JP865588U patent/JPH01113378U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269508A (en) * | 2005-03-22 | 2006-10-05 | Hitachi Ltd | Printed-wiring board and method of determining erosion state |