JPS63193839U - - Google Patents

Info

Publication number
JPS63193839U
JPS63193839U JP8429187U JP8429187U JPS63193839U JP S63193839 U JPS63193839 U JP S63193839U JP 8429187 U JP8429187 U JP 8429187U JP 8429187 U JP8429187 U JP 8429187U JP S63193839 U JPS63193839 U JP S63193839U
Authority
JP
Japan
Prior art keywords
integrated circuit
conductor
pad
circuit section
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8429187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8429187U priority Critical patent/JPS63193839U/ja
Publication of JPS63193839U publication Critical patent/JPS63193839U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す集積回路チツ
プの平面図、第2図は従来の一例を示す集積回路
チツプの平面図である。 1……集積回路チツプ、2……外部接続用端子
、3……導体パツド、4,5……パツドカバー開
口部、6……導体引出部、7……集積回路部。
FIG. 1 is a plan view of an integrated circuit chip showing an embodiment of the present invention, and FIG. 2 is a plan view of an integrated circuit chip showing a conventional example. DESCRIPTION OF SYMBOLS 1... Integrated circuit chip, 2... External connection terminal, 3... Conductor pad, 4, 5... Pad cover opening, 6... Conductor drawer, 7... Integrated circuit section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路部の周囲に配置される導体パツドと、
前記導体パツドおよび前記集積回路部を接続する
導体引出部と、前記集積回路部および前記導体パ
ツドの全面を覆うカバーの前記導体パツド上にそ
れぞれ形成される二つのパツドカバー開口部とに
より外部接続端子を形成し、前記パツドカバー開
口部の一方が他方の開口部に対して一定方向に一
定間隔だけ離すようにして形成することを特徴と
する集積回路チツプ。
a conductor pad placed around the integrated circuit section;
External connection terminals are connected by a conductor draw-out portion that connects the conductor pad and the integrated circuit section, and two pad cover openings formed respectively on the conductor pads of a cover that covers the entire surface of the integrated circuit section and the conductor pad. 1. An integrated circuit chip, characterized in that one of the pad cover openings is formed at a constant distance in a constant direction from the other opening.
JP8429187U 1987-05-29 1987-05-29 Pending JPS63193839U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8429187U JPS63193839U (en) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8429187U JPS63193839U (en) 1987-05-29 1987-05-29

Publications (1)

Publication Number Publication Date
JPS63193839U true JPS63193839U (en) 1988-12-14

Family

ID=30938657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8429187U Pending JPS63193839U (en) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPS63193839U (en)

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