JPS63195755U - - Google Patents
Info
- Publication number
- JPS63195755U JPS63195755U JP8767987U JP8767987U JPS63195755U JP S63195755 U JPS63195755 U JP S63195755U JP 8767987 U JP8767987 U JP 8767987U JP 8767987 U JP8767987 U JP 8767987U JP S63195755 U JPS63195755 U JP S63195755U
- Authority
- JP
- Japan
- Prior art keywords
- out conductor
- lead
- power supply
- chip mounting
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図はそれぞれ本考案の第１及び
第２の実施例の平面図、第３図は従来の半導体装
置用パツケージの一例の平面図である。
１……基板、２……半導体チツプ搭載部、３…
…外部導体、４，４ａ，４ｂ……電源用の引出し
導体、５……接地用の引出し導体、６……信号用
の引出し導体、７，８……ヒユーズ。
1 and 2 are plan views of first and second embodiments of the present invention, respectively, and FIG. 3 is a plan view of an example of a conventional package for a semiconductor device. 1... Board, 2... Semiconductor chip mounting section, 3...
...outer conductor, 4, 4a, 4b... lead-out conductor for power supply, 5... lead-out conductor for grounding, 6... lead-out conductor for signal, 7, 8... fuse.
Claims (1)
前記半導体チツプ搭載部から前記基板の周辺部へ
向つて形成される電源用引出し導体と接地用引出
し導体と、前記電源用引出し導体と接地用引出し
導体のうち少くとも一方に挿入されるヒユーズと
を有することを特徴とする半導体装置用パツケー
ジ。 a board having a semiconductor chip mounting section in the center;
A power supply lead-out conductor and a grounding lead-out conductor formed from the semiconductor chip mounting portion toward a peripheral portion of the substrate, and a fuse inserted into at least one of the power supply lead-out conductor and the grounding lead-out conductor. A package for a semiconductor device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8767987U JPS63195755U (en) | 1987-06-05 | 1987-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8767987U JPS63195755U (en) | 1987-06-05 | 1987-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195755U true JPS63195755U (en) | 1988-12-16 |
Family
ID=30945109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8767987U Pending JPS63195755U (en) | 1987-06-05 | 1987-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195755U (en) |
-
1987
- 1987-06-05 JP JP8767987U patent/JPS63195755U/ja active Pending