JPS60174253U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS60174253U JPS60174253U JP6214784U JP6214784U JPS60174253U JP S60174253 U JPS60174253 U JP S60174253U JP 6214784 U JP6214784 U JP 6214784U JP 6214784 U JP6214784 U JP 6214784U JP S60174253 U JPS60174253 U JP S60174253U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- substrate
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路装置を説明する断面図、第
２図は本考案に依る混法集積回路装置を説明する断面図
、第３図は本考案に用いる樹脂製の蓋体を説明する平面
図である。
主な図番の説明、１１は混成集積回路基板、１２は導電
路、１・３は半導体素子、１７は樹脂製の蓋体、１９は
支柱である。FIG. 1 is a sectional view illustrating a conventional hybrid integrated circuit device, FIG. 2 is a sectional view illustrating a hybrid integrated circuit device according to the present invention, and FIG. 3 is a sectional view illustrating a resin lid used in the present invention. FIG. Explanation of main figure numbers: 11 is a hybrid integrated circuit board, 12 is a conductive path, 1 and 3 are semiconductor elements, 17 is a resin lid, and 19 is a support.
Claims (1)
所望の回路素子を固着し前記基板を覆う蓋体を基板に固
着した混成集積回路装置に於いて、前記蓋体に支柱を設
は前記基板に当接して成る混成集積回路装置。In a hybrid integrated circuit device in which a desired conductive path is provided on a hybrid integrated circuit board, a desired circuit element is fixed on the conductive path, and a cover body covering the substrate is fixed to the substrate, a support is provided on the cover body. is a hybrid integrated circuit device that is in contact with the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6214784U JPS60174253U (en) | 1984-04-25 | 1984-04-25 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6214784U JPS60174253U (en) | 1984-04-25 | 1984-04-25 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60174253U true JPS60174253U (en) | 1985-11-19 |
Family
ID=30591084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6214784U Pending JPS60174253U (en) | 1984-04-25 | 1984-04-25 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60174253U (en) |
-
1984
- 1984-04-25 JP JP6214784U patent/JPS60174253U/en active Pending
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