JPS60144272U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS60144272U
JPS60144272U JP3148284U JP3148284U JPS60144272U JP S60144272 U JPS60144272 U JP S60144272U JP 3148284 U JP3148284 U JP 3148284U JP 3148284 U JP3148284 U JP 3148284U JP S60144272 U JPS60144272 U JP S60144272U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
wiring material
general
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3148284U
Other languages
Japanese (ja)
Inventor
廣江 敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3148284U priority Critical patent/JPS60144272U/en
Publication of JPS60144272U publication Critical patent/JPS60144272U/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の平面図である。 1・・・・・・混成集積回路基板、2,3・・・・・・
導電ランド、4・・・・・・高伝導率導電体配線。
FIG. 1 is a plan view of an embodiment of the present invention. 1... Hybrid integrated circuit board, 2, 3...
Conductive land, 4...High conductivity conductor wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上の導電体配線のうち、大部分は一般の配線材料で
形成され、残りの一部分は、前記一般の配線材料より伝
導率の大きい配線材料で形成されていることを特徴とす
る混成集積回路装置。
A hybrid integrated circuit characterized in that most of the conductor wiring on the substrate is formed of a general wiring material, and the remaining part is formed of a wiring material having higher conductivity than the general wiring material. Device.
JP3148284U 1984-03-05 1984-03-05 Hybrid integrated circuit device Pending JPS60144272U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3148284U JPS60144272U (en) 1984-03-05 1984-03-05 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3148284U JPS60144272U (en) 1984-03-05 1984-03-05 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS60144272U true JPS60144272U (en) 1985-09-25

Family

ID=30532132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3148284U Pending JPS60144272U (en) 1984-03-05 1984-03-05 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS60144272U (en)

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