JPS58135948U - Sealing lid structure for hybrid integrated circuits - Google Patents
Sealing lid structure for hybrid integrated circuitsInfo
- Publication number
- JPS58135948U JPS58135948U JP3281082U JP3281082U JPS58135948U JP S58135948 U JPS58135948 U JP S58135948U JP 3281082 U JP3281082 U JP 3281082U JP 3281082 U JP3281082 U JP 3281082U JP S58135948 U JPS58135948 U JP S58135948U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- sealing lid
- lid structure
- integrated circuits
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を説明する断面図、第２図および第３図
は本考案を説明する上面図および分解断面図である。
１１は混成集積回路基板、１２は段部、１３は溝、１４
は外部リード線を設ける部分、′１５は切、り込み部、
１６は接着シートである。FIG. 1 is a sectional view illustrating a conventional example, and FIGS. 2 and 3 are a top view and an exploded sectional view illustrating the present invention. 11 is a hybrid integrated circuit board, 12 is a step, 13 is a groove, 14
'15 is the part where the external lead wire is provided,'15 is the notch,
16 is an adhesive sheet.
Claims (1)
底状の混成集積回路の封止蓋構造において、前記段部に
溝を設けて余った接着樹脂を吸入することを特徴とする
混成集積回路の封止蓋構造。A sealing lid structure for a bottomed hybrid integrated circuit in which a stepped portion is formed against which a peripheral end of a hybrid integrated circuit board comes into contact, characterized in that a groove is provided in the stepped portion to suck in excess adhesive resin. Sealing lid structure for hybrid integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3281082U JPS58135948U (en) | 1982-03-08 | 1982-03-08 | Sealing lid structure for hybrid integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3281082U JPS58135948U (en) | 1982-03-08 | 1982-03-08 | Sealing lid structure for hybrid integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58135948U true JPS58135948U (en) | 1983-09-13 |
Family
ID=30044392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3281082U Pending JPS58135948U (en) | 1982-03-08 | 1982-03-08 | Sealing lid structure for hybrid integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58135948U (en) |
-
1982
- 1982-03-08 JP JP3281082U patent/JPS58135948U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5827934U (en) | semiconductor equipment | |
| JPS58135948U (en) | Sealing lid structure for hybrid integrated circuits | |
| JPS5961579U (en) | housing | |
| JPS5858342U (en) | hybrid integrated circuit | |
| JPS6054340U (en) | integrated circuit | |
| JPS58123576U (en) | Lead wire for circuit element airtight package | |
| JPS5918437U (en) | multi-terminal electronic components | |
| JPS58105200U (en) | integrated circuit components | |
| JPS619849U (en) | circuit board | |
| JPS59164241U (en) | Ceramic package | |
| JPS58148963U (en) | package parts | |
| JPS5834749U (en) | hybrid integrated circuit | |
| JPS599532U (en) | electronic components | |
| JPS59111052U (en) | Hybrid integrated circuit device | |
| JPS5942028U (en) | electronic components | |
| JPS60174253U (en) | Hybrid integrated circuit device | |
| JPS58140642U (en) | Hybrid IC case enclosure structure | |
| JPS5866647U (en) | Sealing structure of hybrid integrated circuit | |
| JPS59111051U (en) | Hybrid integrated circuit device | |
| JPS60125738U (en) | Hybrid integrated circuit device | |
| JPS59176152U (en) | Hybrid integrated circuit structure | |
| JPS6041054U (en) | Integrated circuit packages | |
| JPS58127655U (en) | Hybrid integrated circuit device | |
| JPS6013746U (en) | Sealing structure of hybrid integrated circuit | |
| JPS58153459U (en) | semiconductor equipment |