JPH0377454U - - Google Patents
Info
- Publication number
- JPH0377454U JPH0377454U JP13813889U JP13813889U JPH0377454U JP H0377454 U JPH0377454 U JP H0377454U JP 13813889 U JP13813889 U JP 13813889U JP 13813889 U JP13813889 U JP 13813889U JP H0377454 U JPH0377454 U JP H0377454U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor element
- element substrate
- connecting conductor
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Description
第１図は本考案の半導体装置の一実施例の半導
体素子部の断面図、第２図は第１図の接続導体２
の斜視図、第３図は本考案の半導体装置の異なる
実施例の半導体素子部の断面図、第４図は第３図
の接続導体２の斜視図、第５図は従来の半導体装
置の一例の半導体素子部の断面図である。
１……容器底板、２……接続導体、２１……電
極固着部、２２……凸部、２３……外部端子、３
……接続導体、３３……外部端子、４……ダイオ
ード素子基板（半導体素子基板）、６……金属細
線、７……保護樹脂。
FIG. 1 is a sectional view of a semiconductor element portion of an embodiment of the semiconductor device of the present invention, and FIG. 2 is a connecting conductor 2 of FIG. 1.
3 is a cross-sectional view of the semiconductor element portion of a different embodiment of the semiconductor device of the present invention, FIG. 4 is a perspective view of the connecting conductor 2 of FIG. 3, and FIG. 5 is an example of a conventional semiconductor device. FIG. 2 is a cross-sectional view of the semiconductor element portion of FIG. DESCRIPTION OF SYMBOLS 1... Container bottom plate, 2... Connection conductor, 21... Electrode fixing part, 22... Convex part, 23... External terminal, 3
... Connection conductor, 33 ... External terminal, 4 ... Diode element board (semiconductor element board), 6 ... Thin metal wire, 7 ... Protective resin.
Claims (1)
が固着され、該半導体素子基板の他面側の電極が
金属細線を介して異なる接続導体に接続され、こ
れら接続導体が容器外に引き出されてそれぞれ外
部端子を形成し、かつ前記一接続導体上の半導体
素子基板を覆うように保護樹脂を塗布してなる半
導体装置において、半導体素子基板の一面側の電
極が固着された接続導体の外部端子と電極固着部
との間に凸部が形成されてなることを特徴とする
半導体装置。 An electrode on one side of the semiconductor element substrate is fixed onto one connecting conductor, an electrode on the other side of the semiconductor element substrate is connected to a different connecting conductor via a thin metal wire, and these connecting conductors are drawn out of the container. In a semiconductor device in which a protective resin is applied to form an external terminal and cover a semiconductor element substrate on one of the connecting conductors, an external terminal of the connecting conductor to which an electrode on one side of the semiconductor element substrate is fixed; A semiconductor device characterized in that a convex portion is formed between the electrode fixing portion and the electrode fixing portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13813889U JPH0727640Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13813889U JPH0727640Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377454U true JPH0377454U (en) | 1991-08-05 |
| JPH0727640Y2 JPH0727640Y2 (en) | 1995-06-21 |
Family
ID=31685260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13813889U Expired - Fee Related JPH0727640Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727640Y2 (en) |
-
1989
- 1989-11-29 JP JP13813889U patent/JPH0727640Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727640Y2 (en) | 1995-06-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |