JPS6153945U - - Google Patents
Info
- Publication number
- JPS6153945U JPS6153945U JP13771384U JP13771384U JPS6153945U JP S6153945 U JPS6153945 U JP S6153945U JP 13771384 U JP13771384 U JP 13771384U JP 13771384 U JP13771384 U JP 13771384U JP S6153945 U JPS6153945 U JP S6153945U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- case
- semiconductor chip
- connection pattern
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図は夫々本考案に係る半導体装
置の一実施例の斜視図及び縦断面図、第３図及び
第４図は夫々上記装置を他の基板に実装した各種
の例を示す斜視図、第５図及び第６図は夫々従来
の半導体装置の斜視図及び縦断面図である。
１，７…リードフレーム、１ａ，７ａ…端子部
、２…半導体ケース、３…半導体搭載部（キヤビ
テイ）、４…半導体チツプ、５…ボンデイング部
、６…金属細線、９…基板、１０…接続パターン
、１１，２１…半導体装置。
1 and 2 are respectively a perspective view and a vertical cross-sectional view of an embodiment of the semiconductor device according to the present invention, and FIGS. 3 and 4 respectively show various examples in which the above device is mounted on other substrates. The perspective view, FIG. 5, and FIG. 6 are a perspective view and a vertical cross-sectional view, respectively, of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1, 7...Lead frame, 1a, 7a...Terminal part, 2...Semiconductor case, 3...Semiconductor mounting part (cavity), 4...Semiconductor chip, 5...Bonding part, 6...Metal thin wire, 9...Substrate, 10...Connection Pattern, 11, 21... semiconductor device.
Claims (1)
た半導体チツプと、夫々一端が該半導体チツプに
接続され、かつ夫々他端が該半導体ケースを介し
て外方へ突出され、他の基板の接続パターンに対
応接続される複数のリードフレームとよりなり、
該各リードフレームを可撓性導体により形成した
構成としてなる半導体装置。 A semiconductor case and a semiconductor chip housed in the semiconductor case, each having one end connected to the semiconductor chip, and each other end protruding outward through the semiconductor case and connected to a connection pattern of another board. Compatible with multiple lead frames to be connected,
A semiconductor device having a structure in which each lead frame is formed of a flexible conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13771384U JPS6153945U (en) | 1984-09-11 | 1984-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13771384U JPS6153945U (en) | 1984-09-11 | 1984-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6153945U true JPS6153945U (en) | 1986-04-11 |
Family
ID=30696124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13771384U Pending JPS6153945U (en) | 1984-09-11 | 1984-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6153945U (en) |
-
1984
- 1984-09-11 JP JP13771384U patent/JPS6153945U/ja active Pending
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