JPS633160U - - Google Patents
Info
- Publication number
- JPS633160U JPS633160U JP9618286U JP9618286U JPS633160U JP S633160 U JPS633160 U JP S633160U JP 9618286 U JP9618286 U JP 9618286U JP 9618286 U JP9618286 U JP 9618286U JP S633160 U JPS633160 U JP S633160U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- heat
- insulating tape
- resistant insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図ａ及びｂは本考案の一実施例の断面図及
び平面透視図、第２図は従来の集積回路装置の一
例を示す断面図である。
１，１１……集積回路素子、２，１２……樹脂
、３，１３……ワイヤー、４，１４……リードフ
レーム、４ａ，１４ａ……内部リード端子、５，
１５……外部リード、６，１６……接着剤（ペー
スト）、７……耐熱性絶縁テープ、１７……アイ
ランド。
1A and 1B are a sectional view and a plan perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view showing an example of a conventional integrated circuit device. 1, 11... Integrated circuit element, 2, 12... Resin, 3, 13... Wire, 4, 14... Lead frame, 4a, 14a... Internal lead terminal, 5,
15...External lead, 6, 16...Adhesive (paste), 7...Heat-resistant insulating tape, 17...Island.
Claims (1)
ワイヤにより接続して樹脂封止し前記リードフレ
ームの一端を外部リードとして外部に突出させて
なる集積回路装置において、前記内部リードを固
定する耐熱性絶縁テープを備え且つ前記外部リー
ドが該耐熱性絶縁テープの裏面から突出してなる
ことを特徴とする集積回路装置。 In an integrated circuit device in which an integrated circuit element is connected to internal leads of a lead frame by wires and sealed with resin, and one end of the lead frame is made to protrude outside as an external lead, a heat-resistant insulating tape for fixing the internal leads is provided. An integrated circuit device comprising: an integrated circuit device, wherein the external lead protrudes from a back surface of the heat-resistant insulating tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9618286U JPS633160U (en) | 1986-06-23 | 1986-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9618286U JPS633160U (en) | 1986-06-23 | 1986-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633160U true JPS633160U (en) | 1988-01-11 |
Family
ID=30961641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9618286U Pending JPS633160U (en) | 1986-06-23 | 1986-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345895A (en) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | Semiconductor device, lead frame and manufacturing method thereof |
-
1986
- 1986-06-23 JP JP9618286U patent/JPS633160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345895A (en) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | Semiconductor device, lead frame and manufacturing method thereof |
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