JPH0379442U - - Google Patents
Info
- Publication number
- JPH0379442U JPH0379442U JP12316290U JP12316290U JPH0379442U JP H0379442 U JPH0379442 U JP H0379442U JP 12316290 U JP12316290 U JP 12316290U JP 12316290 U JP12316290 U JP 12316290U JP H0379442 U JPH0379442 U JP H0379442U
- Authority
- JP
- Japan
- Prior art keywords
- external
- lead
- insulator
- external lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図〜第４図は従来の絶縁物封止半導体装置
を示す。第５図〜第９図は本考案に係る絶縁物封
止半導体装置を示す。第１図、第３図、第５図お
よび第７図は平面図で、第２図、第４図、第６図
および第８図はそれぞれのＡ−Ａ線断面図である
。第９図も平面図である。
１……パワートランジスタチツプ（半導体素子
）、２……放熱板、３，４，５……外部リード、
３ａ，４ａ，５ａ……外部リードの幅広部、３ｂ
，４ｂ，５ｂ……外部リードの幅狭部、４ｃ，５
ｃ……外部リードの内側リード線用端子部、６，
７……内部リード線、８……樹脂体（絶縁物）、
９……連結部材残存部、１０，１１……樹脂体の
段差部、１２……樹脂体の凸部。
1 to 4 show a conventional insulator-sealed semiconductor device. 5 to 9 show an insulator-sealed semiconductor device according to the present invention. 1, 3, 5, and 7 are plan views, and FIGS. 2, 4, 6, and 8 are sectional views taken along the line A--A. FIG. 9 is also a plan view. 1... Power transistor chip (semiconductor element), 2... Heat sink, 3, 4, 5... External lead,
3a, 4a, 5a... wide part of external lead, 3b
, 4b, 5b... Narrow portion of external lead, 4c, 5
c...terminal part for the inner lead wire of the outer lead, 6,
7... Internal lead wire, 8... Resin body (insulator),
9... Connecting member remaining portion, 10, 11... Step portion of resin body, 12... Convex portion of resin body.
Claims (1)
され、第１、第２および第３の外部リードが第１
の外部リードを中心にして並列配置され、前記第
１の外部リードの一端は前記放熱板に連結され、
前記第２と第３の外部リードの一端はそれぞれリ
ード線接続用端子部となつて前記放熱板に隣接し
、前記第２と第３の外部リードの前記リード線接
続用端子部と前記半導体素子の表面はそれぞれ内
部リード線で接続され、少なくとも前記半導体素
子と前記第１、第２および第３の外部リードの前
記一端と前記内部リード線とが絶縁物によつて封
止されている構造において、 前記第１、第２および第３の外部リードは前記
絶縁物からの導出側が幅広部、前記幅広部から先
端側が幅狭部となつており、前記第１の外部リー
ドの幅広部は前記第１の外部リードの幅狭部を前
記絶縁物まで延長した部分の両側に張出しており
、前記第２および第３の外部リードの幅広部はそ
れぞれ前記第２および第３の外部リードの幅狭部
を前記絶縁物まで延長した部分の前記第１の外部
リードに対面する側と反対側にのみ張出しており
、前記第２および第３の外部リードの前記第１の
外部リードに対面する側は前記絶縁物から前記先
端側まで直線的に延びた形状とし、 かつ前記絶縁物に凸部を設けてこの凸の頂部か
ら前記第１の外部リードを導出し、前記凸部の頂
部に対して相対的に凹部となる底面から前記第２
と第３の外部リードをそれぞれ導出していること
を特徴とする半導体装置。[Claims for Utility Model Registration] The back surface of the semiconductor element is fixed to one main surface of the heat sink, and the first, second and third external leads are connected to the first
are arranged in parallel around the external lead of the first external lead, one end of the first external lead is connected to the heat sink,
One ends of the second and third external leads each serve as lead wire connection terminal portions and are adjacent to the heat sink, and the lead wire connection terminal portions of the second and third external leads and the semiconductor element are connected to each other by internal lead wires, and at least the semiconductor element, the one ends of the first, second and third external leads, and the internal lead wires are sealed with an insulator. The first, second, and third external leads have a wide portion on the side leading out from the insulator, and a narrow portion on the tip side from the wide portion, and the wide portion of the first external lead is the wide portion on the side leading out from the insulator. The narrow portion of the first external lead extends to both sides of the extended portion to the insulator, and the wide portions of the second and third external leads overlap the narrow portions of the second and third external leads, respectively. extends only to the side opposite to the side facing the first external lead of the portion extended to the insulator, and the sides of the second and third external leads facing the first external lead are The first external lead is shaped to extend linearly from the insulator to the tip side, and a convex portion is provided on the insulator, and the first external lead is led out from the top of the convex portion, and the first external lead is led out from the top of the convex portion, and The second
and a third external lead, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12316290U JPH0349400Y2 (en) | 1990-11-22 | 1990-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12316290U JPH0349400Y2 (en) | 1990-11-22 | 1990-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0379442U true JPH0379442U (en) | 1991-08-13 |
| JPH0349400Y2 JPH0349400Y2 (en) | 1991-10-22 |
Family
ID=31671152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12316290U Expired JPH0349400Y2 (en) | 1990-11-22 | 1990-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349400Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2899754A3 (en) * | 2014-01-27 | 2015-10-07 | Samsung Electronics Co., Ltd | Semiconductor device |
-
1990
- 1990-11-22 JP JP12316290U patent/JPH0349400Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2899754A3 (en) * | 2014-01-27 | 2015-10-07 | Samsung Electronics Co., Ltd | Semiconductor device |
| US9711435B2 (en) | 2014-01-27 | 2017-07-18 | Samsung Electronics Co., Ltd. | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349400Y2 (en) | 1991-10-22 |
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