JPS6329954U - - Google Patents

Info

Publication number
JPS6329954U
JPS6329954U JP12398486U JP12398486U JPS6329954U JP S6329954 U JPS6329954 U JP S6329954U JP 12398486 U JP12398486 U JP 12398486U JP 12398486 U JP12398486 U JP 12398486U JP S6329954 U JPS6329954 U JP S6329954U
Authority
JP
Japan
Prior art keywords
semiconductor device
lead wire
external lead
frame
advance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12398486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12398486U priority Critical patent/JPS6329954U/ja
Publication of JPS6329954U publication Critical patent/JPS6329954U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例装置の製造に用い
るリードフレームのフレーム状態を示す図、第２
図は本考案の一実施例による半導体装置を示す図
、第３図は従来の半導体装置を示す図、第４図は
従来の半導体装置の製造に用いるリードフレーム
のフレーム状態を示す図である。 １は半導体装置、２はリード端子（外部導出リ
ード線）、４はリードフレーム、５は樹脂である
。 FIG. 1 is a diagram showing the frame state of a lead frame used in manufacturing a device according to an embodiment of the present invention, and FIG.
The figures show a semiconductor device according to an embodiment of the present invention, FIG. 3 shows a conventional semiconductor device, and FIG. 4 shows a frame state of a lead frame used in manufacturing a conventional semiconductor device. 1 is a semiconductor device, 2 is a lead terminal (external lead wire), 4 is a lead frame, and 5 is a resin.

Claims (1)

【実用新案登録請求の範囲】 外部導出リード線を有する半導体装置において
、 リードフレームをフレーム状態であらかじめフ
オーミング成形した外部導出リード線を有するこ
とを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor device having an external lead wire, characterized in that the semiconductor device has an external lead wire formed by forming a lead frame in advance in a frame state.
JP12398486U 1986-08-12 1986-08-12 Pending JPS6329954U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12398486U JPS6329954U (en) 1986-08-12 1986-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12398486U JPS6329954U (en) 1986-08-12 1986-08-12

Publications (1)

Publication Number Publication Date
JPS6329954U true JPS6329954U (en) 1988-02-27

Family

ID=31015587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12398486U Pending JPS6329954U (en) 1986-08-12 1986-08-12

Country Status (1)

Country Link
JP (1) JPS6329954U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344466B2 (en) * 1972-06-22 1978-11-29
JPS561549A (en) * 1979-06-20 1981-01-09 Toshiba Corp Semiconductor device
JPS58123748A (en) * 1982-01-11 1983-07-23 テキサス・インスツルメンツ・インコ−ポレイテツド Package for semiconductor device and method of producing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344466B2 (en) * 1972-06-22 1978-11-29
JPS561549A (en) * 1979-06-20 1981-01-09 Toshiba Corp Semiconductor device
JPS58123748A (en) * 1982-01-11 1983-07-23 テキサス・インスツルメンツ・インコ−ポレイテツド Package for semiconductor device and method of producing same

Similar Documents

Publication Publication Date Title
JPS6329954U (en)
JPH0176040U (en)
JPH0265355U (en)
JPS62154655U (en)
JPS633160U (en)
JPS62122359U (en)
JPS6382949U (en)
JPS6359325U (en)
JPH0286144U (en)
JPS6424848U (en)
JPS63201331U (en)
JPS6196557U (en)
JPH031543U (en)
JPH01100452U (en)
JPH0252452U (en)
JPS6312854U (en)
JPS6033451U (en) Resin-encapsulated semiconductor device
JPS6382945U (en)
JPS6298240U (en)
JPS61106044U (en)
JPS6375043U (en)
JPS6355556U (en)
JPS59127247U (en) Glass sealed semiconductor device
JPS6190245U (en)
JPH0365245U (en)