JPS6196557U - - Google Patents
Info
- Publication number
- JPS6196557U JPS6196557U JP18182584U JP18182584U JPS6196557U JP S6196557 U JPS6196557 U JP S6196557U JP 18182584 U JP18182584 U JP 18182584U JP 18182584 U JP18182584 U JP 18182584U JP S6196557 U JPS6196557 U JP S6196557U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- package
- bent
- resin
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例の製造工程途中の状態
を示す斜視図（部分を示す）、第２図は第１図で
ダムを切断した後に外部リードを折り曲げた状態
を示す斜視図（部分を示す）、第３図は従来の樹
脂封止型半導体装置の製造工程途中の状態を示す
斜視図（部分を示す）である。
１１…パツケージ、１２…ダム、１３…外部リ
ード、１４…パツケージとダムとの間にできる樹
脂部分、１５…ダムの切り残し部分、Ｌ…パツケ
ージとダムとの距離、ｔ…外部リードの板厚。
Fig. 1 is a perspective view (partially shown) showing a state in the middle of the manufacturing process of an embodiment of the present invention, and Fig. 2 is a perspective view (partially shown) showing a state in which the external lead is bent after cutting the dam in Fig. 1. FIG. 3 is a perspective view (partially shown) showing a state in the middle of the manufacturing process of a conventional resin-sealed semiconductor device. 11...Package, 12...Dam, 13...External lead, 14...Resin part formed between package and dam, 15...Uncut portion of dam, L...Distance between package and dam, t...Thickness of external lead .
Claims (1)
界から曲げられてなる樹脂封止型半導体装置にお
いて、ダム部はパツケージの端から少なくとも外
部リードの板厚以上離れていることを特徴とする
樹脂封止型半導体装置。 A resin-sealed semiconductor device in which an external lead is bent from a boundary between the external lead and a package, wherein the dam portion is separated from an end of the package by at least the thickness of the external lead. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18182584U JPS6196557U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18182584U JPS6196557U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196557U true JPS6196557U (en) | 1986-06-21 |
Family
ID=30739366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18182584U Pending JPS6196557U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196557U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5269568A (en) * | 1975-12-08 | 1977-06-09 | Mitsubishi Electric Corp | Semiconductor device |
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
-
1984
- 1984-11-30 JP JP18182584U patent/JPS6196557U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5269568A (en) * | 1975-12-08 | 1977-06-09 | Mitsubishi Electric Corp | Semiconductor device |
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |