JPS55103753A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPS55103753A
JPS55103753A JP1146279A JP1146279A JPS55103753A JP S55103753 A JPS55103753 A JP S55103753A JP 1146279 A JP1146279 A JP 1146279A JP 1146279 A JP1146279 A JP 1146279A JP S55103753 A JPS55103753 A JP S55103753A
Authority
JP
Japan
Prior art keywords
lead
frame
semiconductor device
lead frame
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1146279A
Other languages
Japanese (ja)
Inventor
Keizo Otsuki
Kazuo Shimizu
Fumihito Inoue
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1146279A priority Critical patent/JPS55103753A/en
Publication of JPS55103753A publication Critical patent/JPS55103753A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To simplify shipping operation, by retaining the connection of a sealing part and a lead frame without cutting specified leads when leads are formed by cutting, in an electronic componenet to be assembled by using a lead frame.
CONSTITUTION: Frame 10 of lead frame 9 is connected with semiconductor device 11 via tub lead 13 expanding from the mold part. Lead 14 is in the condition that if it is cut at the tab lead part it comes off from frame 9 and can be used directly. Tub lead 13 is provided with chocolate break 15 so that it can be broken easily. Since a semiconductor device like this can be handled in lead frame units, the work of containing a semiconductor device in a magazine is not required, so that shipping operation is made easy.
COPYRIGHT: (C)1980,JPO&Japio
JP1146279A 1979-02-05 1979-02-05 Electronic component Pending JPS55103753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1146279A JPS55103753A (en) 1979-02-05 1979-02-05 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1146279A JPS55103753A (en) 1979-02-05 1979-02-05 Electronic component

Publications (1)

Publication Number Publication Date
JPS55103753A true JPS55103753A (en) 1980-08-08

Family

ID=11778752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1146279A Pending JPS55103753A (en) 1979-02-05 1979-02-05 Electronic component

Country Status (1)

Country Link
JP (1) JPS55103753A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117264A (en) * 1980-11-28 1982-07-21 Western Electric Co Capsule device for semiconductor integrated circuit chip
JPS59145549A (en) * 1983-02-09 1984-08-21 Matsushita Electric Ind Co Ltd Electronic parts
JPS60176552U (en) * 1984-04-28 1985-11-22 凸版印刷株式会社 etching parts
JPS6196557U (en) * 1984-11-30 1986-06-21
JPH065759A (en) * 1992-06-23 1994-01-14 Sharp Corp Fabrication of semiconductor device
JPH08250638A (en) * 1995-03-08 1996-09-27 Nec Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259573A (en) * 1975-11-11 1977-05-17 Mitsubishi Electric Corp Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259573A (en) * 1975-11-11 1977-05-17 Mitsubishi Electric Corp Production of semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117264A (en) * 1980-11-28 1982-07-21 Western Electric Co Capsule device for semiconductor integrated circuit chip
JPS59145549A (en) * 1983-02-09 1984-08-21 Matsushita Electric Ind Co Ltd Electronic parts
JPH0526339B2 (en) * 1983-02-09 1993-04-15 Matsushita Electric Ind Co Ltd
JPS60176552U (en) * 1984-04-28 1985-11-22 凸版印刷株式会社 etching parts
JPS6196557U (en) * 1984-11-30 1986-06-21
JPH065759A (en) * 1992-06-23 1994-01-14 Sharp Corp Fabrication of semiconductor device
JPH08250638A (en) * 1995-03-08 1996-09-27 Nec Corp Semiconductor device

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