JPS53126268A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53126268A
JPS53126268A JP4035977A JP4035977A JPS53126268A JP S53126268 A JPS53126268 A JP S53126268A JP 4035977 A JP4035977 A JP 4035977A JP 4035977 A JP4035977 A JP 4035977A JP S53126268 A JPS53126268 A JP S53126268A
Authority
JP
Japan
Prior art keywords
semiconductor device
tab
thinner
occurrence
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4035977A
Other languages
Japanese (ja)
Inventor
Kazunao Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4035977A priority Critical patent/JPS53126268A/en
Publication of JPS53126268A publication Critical patent/JPS53126268A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the occurrence of tab short by making the portions of the peripheral edge part of a tab for pellet mounting thinner than lead end parts.
COPYRIGHT: (C)1978,JPO&Japio
JP4035977A 1977-04-11 1977-04-11 Semiconductor device Pending JPS53126268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4035977A JPS53126268A (en) 1977-04-11 1977-04-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4035977A JPS53126268A (en) 1977-04-11 1977-04-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS53126268A true JPS53126268A (en) 1978-11-04

Family

ID=12578434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4035977A Pending JPS53126268A (en) 1977-04-11 1977-04-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS53126268A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568642A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device
JPS5599755A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Electronic component
JPS58128779A (en) * 1982-01-27 1983-08-01 Nec Corp Semiconductor device
EP1083602A2 (en) * 1999-09-10 2001-03-14 Matsushita Electronics Corporation Lead frame and resin package and photoelectron device using the same
JP2014033093A (en) * 2012-08-03 2014-02-20 Mitsubishi Electric Corp Power semiconductor device
JP2016129257A (en) * 2016-03-11 2016-07-14 三菱電機株式会社 Power semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568642A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device
JPS5599755A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Electronic component
JPS58128779A (en) * 1982-01-27 1983-08-01 Nec Corp Semiconductor device
EP1083602A2 (en) * 1999-09-10 2001-03-14 Matsushita Electronics Corporation Lead frame and resin package and photoelectron device using the same
EP1083602A3 (en) * 1999-09-10 2002-01-16 Matsushita Electric Industrial Co., Ltd. Lead frame and resin package and photoelectron device using the same
US6501156B1 (en) 1999-09-10 2002-12-31 Matsushita Electric Industrial Co., Ltd. Lead frame which includes a die pad, a support lead, and inner leads
JP2014033093A (en) * 2012-08-03 2014-02-20 Mitsubishi Electric Corp Power semiconductor device
JP2016129257A (en) * 2016-03-11 2016-07-14 三菱電機株式会社 Power semiconductor device

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