JPS5599755A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPS5599755A
JPS5599755A JP709779A JP709779A JPS5599755A JP S5599755 A JPS5599755 A JP S5599755A JP 709779 A JP709779 A JP 709779A JP 709779 A JP709779 A JP 709779A JP S5599755 A JPS5599755 A JP S5599755A
Authority
JP
Japan
Prior art keywords
lead
wire
connecting lead
electronic component
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP709779A
Other languages
Japanese (ja)
Inventor
Yasuo Taira
Usuke Enomoto
Haruo Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP709779A priority Critical patent/JPS5599755A/en
Publication of JPS5599755A publication Critical patent/JPS5599755A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To reduce the rate of short circuit by forming the surface of a lead lying opposite a wire lower than other part of the lead surface when the wire is arranged so as to cross the lead.
CONSTITUTION: In manufacturing a transistor, for example, circuit element 6 is fixed to tab 7, and connecting lead 2, emitter electrode lead 4 and the circuit element are connected by means of wire 10. The part 11 of the surface of the connecting lead is formed lower than the other part of the surface of connecting lead 2. By this, even if wire 10 hangs downward, it scarcely comes into contact with connecting lead 2.
COPYRIGHT: (C)1980,JPO&Japio
JP709779A 1979-01-26 1979-01-26 Electronic component Pending JPS5599755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709779A JPS5599755A (en) 1979-01-26 1979-01-26 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709779A JPS5599755A (en) 1979-01-26 1979-01-26 Electronic component

Publications (1)

Publication Number Publication Date
JPS5599755A true JPS5599755A (en) 1980-07-30

Family

ID=11656567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709779A Pending JPS5599755A (en) 1979-01-26 1979-01-26 Electronic component

Country Status (1)

Country Link
JP (1) JPS5599755A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011303A (en) * 1996-11-29 2000-01-04 Nec Corporation Electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103772A (en) * 1975-03-10 1976-09-13 Tokyo Shibaura Electric Co HANDOTA ISOCHI
JPS53126268A (en) * 1977-04-11 1978-11-04 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103772A (en) * 1975-03-10 1976-09-13 Tokyo Shibaura Electric Co HANDOTA ISOCHI
JPS53126268A (en) * 1977-04-11 1978-11-04 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011303A (en) * 1996-11-29 2000-01-04 Nec Corporation Electronic component

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