JPS51103772A - HANDOTA ISOCHI - Google Patents

HANDOTA ISOCHI

Info

Publication number
JPS51103772A
JPS51103772A JP50027975A JP2797575A JPS51103772A JP S51103772 A JPS51103772 A JP S51103772A JP 50027975 A JP50027975 A JP 50027975A JP 2797575 A JP2797575 A JP 2797575A JP S51103772 A JPS51103772 A JP S51103772A
Authority
JP
Japan
Prior art keywords
handota
isochi
handota isochi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50027975A
Other languages
Japanese (ja)
Inventor
Takeo Senda
Keiichi Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP50027975A priority Critical patent/JPS51103772A/en
Publication of JPS51103772A publication Critical patent/JPS51103772A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP50027975A 1975-03-10 1975-03-10 HANDOTA ISOCHI Pending JPS51103772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50027975A JPS51103772A (en) 1975-03-10 1975-03-10 HANDOTA ISOCHI

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50027975A JPS51103772A (en) 1975-03-10 1975-03-10 HANDOTA ISOCHI

Publications (1)

Publication Number Publication Date
JPS51103772A true JPS51103772A (en) 1976-09-13

Family

ID=12235860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50027975A Pending JPS51103772A (en) 1975-03-10 1975-03-10 HANDOTA ISOCHI

Country Status (1)

Country Link
JP (1) JPS51103772A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568642A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device
JPS5599755A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Electronic component
JPH0348436A (en) * 1989-04-17 1991-03-01 Matsushita Electric Ind Co Ltd High frequency semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568642A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device
JPS5599755A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Electronic component
JPH0348436A (en) * 1989-04-17 1991-03-01 Matsushita Electric Ind Co Ltd High frequency semiconductor device

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