JPS61171256U - - Google Patents
Info
- Publication number
- JPS61171256U JPS61171256U JP5466485U JP5466485U JPS61171256U JP S61171256 U JPS61171256 U JP S61171256U JP 5466485 U JP5466485 U JP 5466485U JP 5466485 U JP5466485 U JP 5466485U JP S61171256 U JPS61171256 U JP S61171256U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- covers
- semiconductor device
- cut surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図乃至第３図は本考案の一実施例の半導体
装置を製造する製造工程を示す平面透視図である
。第４図は従来の半導体装置の樹脂封入後の平面
透視図、第５図は第１図の半導体装置をリード切
断・成形した後の断面図、第６図ａ，ｂは、第５
図の半導体装置に信頼性試験を実施した後の断面
図である。
１…外部リード、２…吊りリード、３…切断部
、４…リードフレーム、５…切断面、６…内部リ
ード、７，１７，２７…樹脂、８…ボンデイング
ワイヤ、１０…半導体チツプ、１１…隙間。
1 to 3 are perspective plan views showing a manufacturing process for manufacturing a semiconductor device according to an embodiment of the present invention. FIG. 4 is a plan perspective view of a conventional semiconductor device after resin encapsulation, FIG. 5 is a cross-sectional view of the semiconductor device of FIG. 1 after lead cutting and molding, and FIGS.
FIG. 3 is a cross-sectional view after a reliability test is performed on the semiconductor device shown in the figure. DESCRIPTION OF SYMBOLS 1... External lead, 2... Hanging lead, 3... Cutting part, 4... Lead frame, 5... Cutting surface, 6... Internal lead, 7, 17, 27... Resin, 8... Bonding wire, 10... Semiconductor chip, 11... gap.
Claims (1)
分とリードフレームの枠とを連結する吊りリード
の切断面と同じ表面をもつ内部樹脂と、該内部樹
脂をおおい前記吊りリードの切断面をも被覆する
外部樹脂とで封止したことを特徴とする半導体装
置。 An internal resin having the same surface as the cut surface of the suspension lead that connects the part on which the semiconductor chip is mounted and the frame of the lead frame, and an external resin that covers the internal resin and also covers the cut surface of the suspension lead. A semiconductor device characterized by being sealed with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5466485U JPS61171256U (en) | 1985-04-12 | 1985-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5466485U JPS61171256U (en) | 1985-04-12 | 1985-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171256U true JPS61171256U (en) | 1986-10-24 |
Family
ID=30576627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5466485U Pending JPS61171256U (en) | 1985-04-12 | 1985-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171256U (en) |
-
1985
- 1985-04-12 JP JP5466485U patent/JPS61171256U/ja active Pending