JPH0351850U - - Google Patents
Info
- Publication number
- JPH0351850U JPH0351850U JP11217489U JP11217489U JPH0351850U JP H0351850 U JPH0351850 U JP H0351850U JP 11217489 U JP11217489 U JP 11217489U JP 11217489 U JP11217489 U JP 11217489U JP H0351850 U JPH0351850 U JP H0351850U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- package
- tip
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例による半導体装置の斜視
外形図、第２図は実装組立図、第３図、第４図は
第１図の応用実施例の側面図、第５図は従来の半
導体装置の実装組立図である。図において、
１……半導体素子、２……外部リード、２ａ…
…先端部、２ｂ……湾曲成形部、３……パツケー
ジ。
Fig. 1 is a perspective external view of a semiconductor device according to an embodiment of the present invention, Fig. 2 is a mounting assembly diagram, Figs. 3 and 4 are side views of an applied embodiment of Fig. 1, and Fig. 5 is a conventional semiconductor device. FIG. 3 is an assembly diagram of the device. In the figure, 1...semiconductor element, 2...external lead, 2a...
...Tip part, 2b...Curved molded part, 3...Package.
Claims (1)
工した上で、その先端部との間の中間部位をカー
ル状に湾曲成形したことを特徴とする半導体装置
。 A semiconductor device characterized in that an external lead pulled out from a package is processed into a thin wire, and an intermediate portion between the lead and the tip thereof is formed into a curled shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11217489U JPH0351850U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11217489U JPH0351850U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351850U true JPH0351850U (en) | 1991-05-20 |
Family
ID=31660623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11217489U Pending JPH0351850U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351850U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003024200A (en) * | 2001-07-17 | 2003-01-28 | Ado:Kk | Decorative bedding |
| JP2009119194A (en) * | 2007-11-19 | 2009-06-04 | Hinomoto Shingu Kk | Bag body and its manufacturing method |
-
1989
- 1989-09-26 JP JP11217489U patent/JPH0351850U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003024200A (en) * | 2001-07-17 | 2003-01-28 | Ado:Kk | Decorative bedding |
| JP2009119194A (en) * | 2007-11-19 | 2009-06-04 | Hinomoto Shingu Kk | Bag body and its manufacturing method |