JPH0245618U - - Google Patents
Info
- Publication number
- JPH0245618U JPH0245618U JP12440188U JP12440188U JPH0245618U JP H0245618 U JPH0245618 U JP H0245618U JP 12440188 U JP12440188 U JP 12440188U JP 12440188 U JP12440188 U JP 12440188U JP H0245618 U JPH0245618 U JP H0245618U
- Authority
- JP
- Japan
- Prior art keywords
- contact plate
- lead wire
- crimp terminal
- capacitor
- integrally molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
Description
第１図は本考案に係る第１の実施例であるリー
ド線圧着端子が接触板に溶接された状態を示す斜
視図であり、第２図は本考案に係る第２の実施例
である圧着端子と接触板の一体成型のものを示す
斜視図である。第３図は第１図および第２図に示
されるコンデンサへの取付状態を示す断面図であ
り、第４図は従来のリード線の接触板への接続状
態を示す断面図である。
２……接触板、３……リード線、３ａ……リー
ド芯線、５……圧着端子。
FIG. 1 is a perspective view showing a lead wire crimp terminal welded to a contact plate according to a first embodiment of the present invention, and FIG. 2 is a crimp terminal according to a second embodiment of the present invention. FIG. 3 is a perspective view showing a terminal and a contact plate integrally molded. FIG. 3 is a sectional view showing how the capacitor is attached to the capacitor shown in FIGS. 1 and 2, and FIG. 4 is a sectional view showing how the conventional lead wire is connected to the contact plate. 2...Contact plate, 3...Lead wire, 3a...Lead core wire, 5...Crimp terminal.
Claims (1)
リード線に接続する圧着端子と一体成型したこと
を特徴とするコンデンサの接触板の構造。 A structure of a contact plate for a capacitor, characterized in that the contact plate is integrally molded with a crimp terminal for connecting to a lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988124401U JPH06813Y2 (en) | 1988-09-22 | 1988-09-22 | Structure of capacitor contact plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988124401U JPH06813Y2 (en) | 1988-09-22 | 1988-09-22 | Structure of capacitor contact plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0245618U true JPH0245618U (en) | 1990-03-29 |
| JPH06813Y2 JPH06813Y2 (en) | 1994-01-05 |
Family
ID=31374100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988124401U Expired - Lifetime JPH06813Y2 (en) | 1988-09-22 | 1988-09-22 | Structure of capacitor contact plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06813Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011094918A1 (en) * | 2010-02-05 | 2011-08-11 | 上海皓月电气有限公司 | Sealed capacitor with leading-out cables formed by injection and injection forming method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545218U (en) * | 1978-09-14 | 1980-03-25 |
-
1988
- 1988-09-22 JP JP1988124401U patent/JPH06813Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545218U (en) * | 1978-09-14 | 1980-03-25 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011094918A1 (en) * | 2010-02-05 | 2011-08-11 | 上海皓月电气有限公司 | Sealed capacitor with leading-out cables formed by injection and injection forming method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06813Y2 (en) | 1994-01-05 |