JPS635646U - - Google Patents
Info
- Publication number
- JPS635646U JPS635646U JP9884186U JP9884186U JPS635646U JP S635646 U JPS635646 U JP S635646U JP 9884186 U JP9884186 U JP 9884186U JP 9884186 U JP9884186 U JP 9884186U JP S635646 U JPS635646 U JP S635646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- resin
- wire
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
Description
第１図はこの考案に係る半導体装置の実施例を
示す要部断面図、第２図は従来の半導体装置を示
す断面図、第３図は同上従来例の一部拡大断面図
である。
１：支持基板、２：半導体素子、３：リードフ
レーム、３ａ：先端接続部、３ｂ：突状屈曲部、
４：ワイヤ、５：樹脂。
FIG. 1 is a sectional view of a main part of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a sectional view of a conventional semiconductor device, and FIG. 3 is a partially enlarged sectional view of the conventional semiconductor device. 1: support substrate, 2: semiconductor element, 3: lead frame, 3a: tip connection portion, 3b: protruding bent portion,
4: wire, 5: resin.
Claims (1)
レームの先端接続部とがワイヤで接続され樹脂モ
ールドされた半導体装置において、 該樹脂モールドの内部部分におけるリードフレ
ームに突状屈曲部を形成したことを特徴とする半
導体装置。[Claims for Utility Model Registration] In a semiconductor device in which a semiconductor element mounted on a supporting substrate and a leading end connection portion of a lead frame are connected by a wire and molded in resin, the lead frame has a protruding bend in the inner part of the resin mold. A semiconductor device characterized in that a semiconductor device is formed with a portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9884186U JPS635646U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9884186U JPS635646U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635646U true JPS635646U (en) | 1988-01-14 |
Family
ID=30967169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9884186U Pending JPS635646U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335449A (en) * | 2006-06-12 | 2007-12-27 | Denso Corp | Semiconductor device |
-
1986
- 1986-06-30 JP JP9884186U patent/JPS635646U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335449A (en) * | 2006-06-12 | 2007-12-27 | Denso Corp | Semiconductor device |