JPS61106044U - - Google Patents
Info
- Publication number
- JPS61106044U JPS61106044U JP19325984U JP19325984U JPS61106044U JP S61106044 U JPS61106044 U JP S61106044U JP 19325984 U JP19325984 U JP 19325984U JP 19325984 U JP19325984 U JP 19325984U JP S61106044 U JPS61106044 U JP S61106044U
- Authority
- JP
- Japan
- Prior art keywords
- wide portion
- leads
- lead frame
- adjacent
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
Description
第１図イ〜ニは本考案によるリードフレームを
示し、第１図イはこれを用いた半導体装置の斜視
図、第１図ロは平面図、第１図ハは要部斜視図、
第１図ニは要部断面図である。第２図イ〜ハは従
来のリードフレームを示し、第２図イは平面図、
第２図ロ〜ハは要部斜視図である。
主な図番の説明、２はリード、３はリード２の
幅広部、６はモールド樹脂である。
1A to 1D show a lead frame according to the present invention, FIG. 1A is a perspective view of a semiconductor device using the same, FIG. 1B is a plan view, and FIG. 1C is a perspective view of main parts.
FIG. 1D is a sectional view of the main part. Figures 2A to 2C show conventional lead frames, and Figure 2A is a plan view.
FIGS. 2B to 2C are perspective views of main parts. Explanation of the main figure numbers: 2 is the lead, 3 is the wide part of the lead 2, and 6 is the mold resin.
Claims (1)
し用のリードを有し、該リードのうち少くとも一
部のリードにはモールド樹脂内に幅広部が形成さ
れている半導体装置用リードフレームにおいて、
前記幅広部が隣接する幅広部まで拡張され、前記
幅広部の端部を折り曲げることで隣接する幅広部
と離間することを特徴とするリードフレーム。 A lead frame for a semiconductor device, which has leads for external extraction that are electrically connected to a semiconductor element, and in which at least some of the leads have a wide portion formed in a molded resin,
A lead frame characterized in that the wide portion extends to an adjacent wide portion, and is separated from the adjacent wide portion by bending an end of the wide portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19325984U JPS61106044U (en) | 1984-12-19 | 1984-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19325984U JPS61106044U (en) | 1984-12-19 | 1984-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61106044U true JPS61106044U (en) | 1986-07-05 |
Family
ID=30750678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19325984U Pending JPS61106044U (en) | 1984-12-19 | 1984-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61106044U (en) |
-
1984
- 1984-12-19 JP JP19325984U patent/JPS61106044U/ja active Pending