JPS61196543U - - Google Patents
Info
- Publication number
- JPS61196543U JPS61196543U JP7925585U JP7925585U JPS61196543U JP S61196543 U JPS61196543 U JP S61196543U JP 7925585 U JP7925585 U JP 7925585U JP 7925585 U JP7925585 U JP 7925585U JP S61196543 U JPS61196543 U JP S61196543U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead
- integrated circuit
- electrically connected
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
Description
第１図は本考案装置の実施例を説明するための
正面図、第２図Ａ，Ｂは第１図リードの曲げ加工
状態説明図、第３図は第２図により曲げ加工され
たリードの成形状態説明図、第４図Ａ，Ｂは従来
のプラスチツクモールド用型の斜視図、第５図は
第４図型によるモールド状態説明図、第６図は第
５図によりモールドされたＩＣの斜視図、第７図
は第６図ＩＣのフレーム除去後の曲げ加工工程説
明図、第８図は第７図ＩＣのパーテイングライン
での間隙の発生説明図である。
１…リード、２…パツケージ、３…パーテイン
グライン。
Figure 1 is a front view for explaining the embodiment of the device of the present invention, Figures 2A and B are explanatory views of the bending process of the lead in Figure 1, and Figure 3 is a view of the lead bent as shown in Figure 2. 4A and 4B are perspective views of conventional plastic molding molds, FIG. 5 is a diagram illustrating the molding state using the mold shown in FIG. 4, and FIG. 6 is a perspective view of an IC molded according to FIG. 5. 7 is an explanatory diagram of the bending process after removing the frame of the IC in FIG. 6, and FIG. 8 is an explanatory diagram of generation of gaps at the parting line of the IC in FIG. 7. 1...Lead, 2...Package, 3...Parting line.
Claims (1)
このリードにＩＣチツプの電極が電気的に接続さ
れ、上記ＩＣチツプをプラスチツクパツケージモ
ールドしたＩＣパツケージにおいて、上記プラス
チツクパツケージモールドのパーテイングライン
を有する側に曲げられたリードを有する半導体集
積回路装置。 (2) ＩＣチツプはリードフレームに取着されワ
イヤボンデイングにより電気的に接続されたもの
である実用新案登録請求の範囲第１項記載の半導
体集積回路装置。[Scope of claims for utility model registration] (1) Having multiple leads on at least two sides;
A semiconductor integrated circuit device in which an electrode of an IC chip is electrically connected to the lead, and an IC package in which the IC chip is molded in a plastic package has a lead bent toward a side having a parting line of the plastic package mold. (2) The semiconductor integrated circuit device according to claim 1, wherein the IC chip is attached to a lead frame and electrically connected by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7925585U JPS61196543U (en) | 1985-05-29 | 1985-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7925585U JPS61196543U (en) | 1985-05-29 | 1985-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196543U true JPS61196543U (en) | 1986-12-08 |
Family
ID=30623997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7925585U Pending JPS61196543U (en) | 1985-05-29 | 1985-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196543U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564255A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device sealed up with resin |
| JPS5957466A (en) * | 1982-08-25 | 1984-04-03 | シ−メンス・アクチエンゲゼルシヤフト | Electric device with connecting piece |
| JPS6027150A (en) * | 1983-07-25 | 1985-02-12 | Nec Corp | Resin-sealed type semiconductor device |
-
1985
- 1985-05-29 JP JP7925585U patent/JPS61196543U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564255A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device sealed up with resin |
| JPS5957466A (en) * | 1982-08-25 | 1984-04-03 | シ−メンス・アクチエンゲゼルシヤフト | Electric device with connecting piece |
| JPS6027150A (en) * | 1983-07-25 | 1985-02-12 | Nec Corp | Resin-sealed type semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61196543U (en) | ||
| JPH0249140U (en) | ||
| JPS6234154B2 (en) | ||
| JPS61106044U (en) | ||
| JPH0423330Y2 (en) | ||
| JPH0485751U (en) | ||
| JPH0474458U (en) | ||
| JPS63102313U (en) | ||
| JPS63128745U (en) | ||
| JPH01123356U (en) | ||
| JPS62193729U (en) | ||
| JPH0350U (en) | ||
| JPS59135644U (en) | Resin-encapsulated semiconductor device | |
| JPS61138252U (en) | ||
| JPS6364045U (en) | ||
| JPS6176971U (en) | ||
| JPS63105345U (en) | ||
| JPH0428452U (en) | ||
| JPH01139443U (en) | ||
| JPS59182947U (en) | semiconductor equipment | |
| JPH02106837U (en) | ||
| JPH02114930U (en) | ||
| JPS63132439U (en) | ||
| JPH0263550U (en) | ||
| JPH0485725U (en) |