JPS63167745U - - Google Patents
Info
- Publication number
- JPS63167745U JPS63167745U JP6100587U JP6100587U JPS63167745U JP S63167745 U JPS63167745 U JP S63167745U JP 6100587 U JP6100587 U JP 6100587U JP 6100587 U JP6100587 U JP 6100587U JP S63167745 U JPS63167745 U JP S63167745U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- influence
- external force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例を用いてリード付けを行つた
半導体装置の部分斜視図、第３図は従来のリード
フレームを用いた半導体装置の部分斜視図である
。
１，２……リードフレーム、１ａ，３……外部
リード部、３ａ，４……折曲げ部、５……半導体
素子、６……ボンデイングワイヤ、７……モール
ド樹脂。
1 and 2 are partial perspective views of a semiconductor device with leads attached using one embodiment and another embodiment of the present invention, respectively, and FIG. 3 is a partial perspective view of a semiconductor device using a conventional lead frame. FIG. DESCRIPTION OF SYMBOLS 1, 2... Lead frame, 1a, 3... External lead part, 3a, 4... Bending part, 5... Semiconductor element, 6... Bonding wire, 7... Molding resin.
Claims (1)
レームにおいて、前記樹脂にモールドされる部分
の特定部に、樹脂部外のリードフレームに加えら
れる外力が樹脂内部へ及ぼす影響を小さくするた
めの折曲げ部が設けられていることを特徴とする
半導体装置用リードフレーム。 In a resin mold type lead frame for a semiconductor device, a bent portion is provided at a specific portion of the portion molded in the resin to reduce the influence of an external force applied to the lead frame outside the resin portion on the inside of the resin. A lead frame for semiconductor devices characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6100587U JPS63167745U (en) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6100587U JPS63167745U (en) | 1987-04-21 | 1987-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167745U true JPS63167745U (en) | 1988-11-01 |
Family
ID=30893944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6100587U Pending JPS63167745U (en) | 1987-04-21 | 1987-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167745U (en) |
-
1987
- 1987-04-21 JP JP6100587U patent/JPS63167745U/ja active Pending