JPS63157944U - - Google Patents
Info
- Publication number
- JPS63157944U JPS63157944U JP5111187U JP5111187U JPS63157944U JP S63157944 U JPS63157944 U JP S63157944U JP 5111187 U JP5111187 U JP 5111187U JP 5111187 U JP5111187 U JP 5111187U JP S63157944 U JPS63157944 U JP S63157944U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- semiconductor element
- resin
- magnetic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置の断面図、第２図
は従来の半導体装置の断面図である。
１……半導体素子、２ａ，２ｂ……リードフレ
ーム、３……金属細線、４……トランスフアーモ
ールド樹脂、５……磁性体。
FIG. 1 is a sectional view of a semiconductor device of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Semiconductor element, 2a, 2b...Lead frame, 3...Metal thin wire, 4...Transfer mold resin, 5...Magnetic material.
Claims (1)
記半導体素子内の電極と前記リードフレームとを
金属細線により結線し、更に樹脂によりトランス
フアーモールドして成る半導体装置において、ト
ランスフアーモールド後の樹脂表面に磁性体層を
設けた事を特徴とする半導体装置。 In a semiconductor device in which a semiconductor element is mounted on a lead frame, electrodes in the semiconductor element and the lead frame are connected with thin metal wires, and further transfer molded with resin, a magnetic material is applied to the resin surface after transfer molding. A semiconductor device characterized by having a body layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5111187U JPS63157944U (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5111187U JPS63157944U (en) | 1987-04-03 | 1987-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157944U true JPS63157944U (en) | 1988-10-17 |
Family
ID=30875079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5111187U Pending JPS63157944U (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157944U (en) |
-
1987
- 1987-04-03 JP JP5111187U patent/JPS63157944U/ja active Pending