JPS6291450U - - Google Patents
Info
- Publication number
- JPS6291450U JPS6291450U JP18380885U JP18380885U JPS6291450U JP S6291450 U JPS6291450 U JP S6291450U JP 18380885 U JP18380885 U JP 18380885U JP 18380885 U JP18380885 U JP 18380885U JP S6291450 U JPS6291450 U JP S6291450U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor die
- metal wire
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の要部断面図、第２
図は本考案の他の一実施例の要部断面図、第３図
は従来の樹脂封止型半導体装置の要部断面図であ
る。
１，１′……半導体ダイ、２，２′……金属細
線、３，３′……リードフレームのアイランド部
、４，４′……リードフレームの外部引出しリー
ド、５，５′，６……樹脂、７……空洞部。
Figure 1 is a sectional view of the main parts of an embodiment of the present invention, Figure 2
The figure is a sectional view of a main part of another embodiment of the present invention, and FIG. 3 is a sectional view of a main part of a conventional resin-sealed semiconductor device. 1, 1'...Semiconductor die, 2, 2'...Metal thin wire, 3, 3'...Island part of lead frame, 4, 4'...External lead frame lead, 5, 5', 6... ...Resin, 7...Cavity part.
Claims (1)
導体ダイと、該半導体ダイの電極と外部引出しリ
ードとを接続する金属細線と、該金属細線とリー
ドフレームの接続部は直接樹脂には触れず、リー
ドフレームのアイランド部の半導体ダイが搭載さ
れている面と反対の面の一部が樹脂に密着してい
る構造であることを特徴とする樹脂封止型半導体
装置。 The semiconductor die mounted on the island part of the lead frame, the thin metal wire that connects the electrode of the semiconductor die to the external lead, and the connection between the thin metal wire and the lead frame do not directly touch the resin, and are connected to the lead frame. A resin-sealed semiconductor device characterized in that a part of the surface of the island portion opposite to the surface on which the semiconductor die is mounted is in close contact with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18380885U JPS6291450U (en) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18380885U JPS6291450U (en) | 1985-11-28 | 1985-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291450U true JPS6291450U (en) | 1987-06-11 |
Family
ID=31130885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18380885U Pending JPS6291450U (en) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291450U (en) |
-
1985
- 1985-11-28 JP JP18380885U patent/JPS6291450U/ja active Pending