JPH0468553U - - Google Patents
Info
- Publication number
- JPH0468553U JPH0468553U JP11244590U JP11244590U JPH0468553U JP H0468553 U JPH0468553 U JP H0468553U JP 11244590 U JP11244590 U JP 11244590U JP 11244590 U JP11244590 U JP 11244590U JP H0468553 U JPH0468553 U JP H0468553U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- leads
- semiconductor device
- insulator
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａは本考案の一実施例の平面図、第１図
ｂは第１図ａのＡ−Ａ′断面図、第１図ｃは第１
図ｂのＢ部の拡大図、第２図ａは従来の半導体装
置の断面図、第２図ｂは第２図ａのＣ部の拡大図
である。
１……半導体装置、２……外部リード、３……
内部リード、４……絶縁物、５……ボンデイング
線、６……半導体チツプ、７……樹脂、８……ア
イランド。
Fig. 1a is a plan view of one embodiment of the present invention, Fig. 1b is a sectional view taken along line AA' in Fig. 1a, and Fig. 1c is a
FIG. 2a is an enlarged view of section B in FIG. 2b, FIG. 2a is a sectional view of a conventional semiconductor device, and FIG. 2b is an enlarged view of section C in FIG. 2a. 1...Semiconductor device, 2...External lead, 3...
Internal lead, 4... Insulator, 5... Bonding wire, 6... Semiconductor chip, 7... Resin, 8... Island.
Claims (1)
、内部リードと樹脂の密着性を向上させるために
双方の間に絶縁物を備えることを特徴とする半導
体装置。 A semiconductor device whose leads are shaped after being sealed with resin, characterized in that an insulator is provided between the internal leads and the resin in order to improve their adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244590U JPH0468553U (en) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244590U JPH0468553U (en) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468553U true JPH0468553U (en) | 1992-06-17 |
Family
ID=31859945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11244590U Pending JPH0468553U (en) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468553U (en) |
-
1990
- 1990-10-25 JP JP11244590U patent/JPH0468553U/ja active Pending