JPS6217152U - - Google Patents
Info
- Publication number
- JPS6217152U JPS6217152U JP10998985U JP10998985U JPS6217152U JP S6217152 U JPS6217152 U JP S6217152U JP 10998985 U JP10998985 U JP 10998985U JP 10998985 U JP10998985 U JP 10998985U JP S6217152 U JPS6217152 U JP S6217152U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- bending area
- lead
- thinner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームを使用して製
造された樹脂封止型半導体装置の断面図。第２図
は従来のリードフレームを使用して製造された樹
脂封止型半導体装置の断面図。
１……半導体素子搭載部、２……半導体素子、
３……金属細線、４……金めつき膜、５……イン
ナーリード、５′……インナーリード先端部、６
……外部リード、６′……外部リードの折り曲げ
領域、７……樹脂、８……リードと樹脂との間に
発生した隙間、９……樹脂に発生するクラツク。
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device manufactured using the lead frame of the present invention. FIG. 2 is a cross-sectional view of a resin-sealed semiconductor device manufactured using a conventional lead frame. 1... Semiconductor element mounting part, 2... Semiconductor element,
3... Metal thin wire, 4... Gold plating film, 5... Inner lead, 5'... Inner lead tip, 6
...External lead, 6'...Bending area of external lead, 7...Resin, 8...Gap generated between lead and resin, 9...Crack generated in resin.
Claims (1)
薄くなつている事を特徴とする樹脂封止型の半導
体装置用リードフレーム。 A resin-sealed lead frame for semiconductor devices characterized by a bending area of an external lead portion being thinner than other areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998985U JPS6217152U (en) | 1985-07-17 | 1985-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998985U JPS6217152U (en) | 1985-07-17 | 1985-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217152U true JPS6217152U (en) | 1987-02-02 |
Family
ID=30988603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10998985U Pending JPS6217152U (en) | 1985-07-17 | 1985-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217152U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192258A (en) * | 1987-02-03 | 1988-08-09 | Mitsubishi Electric Corp | Semiconductor device |
| JP2006303086A (en) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | Semiconductor device |
| JP2011018933A (en) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | Semiconductor device, and method of manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (en) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | Semiconductor device and manufacture thereof |
-
1985
- 1985-07-17 JP JP10998985U patent/JPS6217152U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (en) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | Semiconductor device and manufacture thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192258A (en) * | 1987-02-03 | 1988-08-09 | Mitsubishi Electric Corp | Semiconductor device |
| JP2006303086A (en) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | Semiconductor device |
| JP4622646B2 (en) * | 2005-04-19 | 2011-02-02 | 株式会社豊田自動織機 | Semiconductor device |
| JP2011018933A (en) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | Semiconductor device, and method of manufacturing the same |