JPS6188247U - - Google Patents
Info
- Publication number
- JPS6188247U JPS6188247U JP17244284U JP17244284U JPS6188247U JP S6188247 U JPS6188247 U JP S6188247U JP 17244284 U JP17244284 U JP 17244284U JP 17244284 U JP17244284 U JP 17244284U JP S6188247 U JPS6188247 U JP S6188247U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- metal wire
- thin metal
- protective film
- film formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の半導体装置の一実施例の断
面図、第２図は第１図の半導体装置における金球
の部分拡大図、第３図は従来の半導体装置の断面
図である。
１１……半導体チツプ、１２……絶縁膜、１３
……アルミ電極、１４……金属細線、１５……接
続部、１６……半導体チツプ保護膜、１７……封
止樹脂。
FIG. 1 is a sectional view of an embodiment of the semiconductor device of this invention, FIG. 2 is a partially enlarged view of a gold sphere in the semiconductor device of FIG. 1, and FIG. 3 is a sectional view of a conventional semiconductor device. 11... Semiconductor chip, 12... Insulating film, 13
... Aluminum electrode, 14 ... Metal thin wire, 15 ... Connection portion, 16 ... Semiconductor chip protective film, 17 ... Sealing resin.
Claims (1)
導体チツプの電極に接続された外部リード配線接
続用の金属細線と、この金属細線の接続部の全対
の大きさ以下の薄さで上記絶縁膜上に形成された
半導体チツプ保護膜と、この半導体チツプ保護膜
上に形成された封止樹脂とよりなる半導体装置。 An insulating film formed on a semiconductor chip, a thin metal wire for external lead wiring connection connected to an electrode of the semiconductor chip, and a thin metal wire with a thickness less than the size of all pairs of connection parts of the thin metal wire. A semiconductor device comprising a semiconductor chip protective film formed thereon and a sealing resin formed on the semiconductor chip protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244284U JPS6188247U (en) | 1984-11-15 | 1984-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244284U JPS6188247U (en) | 1984-11-15 | 1984-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188247U true JPS6188247U (en) | 1986-06-09 |
Family
ID=30730108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17244284U Pending JPS6188247U (en) | 1984-11-15 | 1984-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188247U (en) |
-
1984
- 1984-11-15 JP JP17244284U patent/JPS6188247U/ja active Pending
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