JPS63149540U - - Google Patents
Info
- Publication number
- JPS63149540U JPS63149540U JP1987042771U JP4277187U JPS63149540U JP S63149540 U JPS63149540 U JP S63149540U JP 1987042771 U JP1987042771 U JP 1987042771U JP 4277187 U JP4277187 U JP 4277187U JP S63149540 U JPS63149540 U JP S63149540U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- island
- lead
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１及び第２図はそれぞれ本考案の第１及び第
２の実施例の断面図、第３図は従来の半導体装置
の一例の断面図である。
１ａ……リード、１ｂ……アイランド、２……
半導体チツプ、３……ボンデイング線、４，４′
，４″……樹脂層、５ａ，５ａ′，５ｂ……絶縁
物層、６，６′……金属層。
1 and 2 are sectional views of the first and second embodiments of the present invention, respectively, and FIG. 3 is a sectional view of an example of a conventional semiconductor device. 1a...Lead, 1b...Island, 2...
Semiconductor chip, 3... Bonding line, 4, 4'
, 4''... Resin layer, 5a, 5a', 5b... Insulator layer, 6, 6'... Metal layer.
Claims (1)
ランドと電気的に前記半導体チツプに接続したリ
ードとを含む半導体装置において、少くとも前記
半導体チツプ、前記アイランド及び前記リードが
絶縁物層を介して遮へい用の導体層で覆われてい
ることを特徴とする半導体装置。 In a semiconductor device including a semiconductor chip, an island on which the semiconductor chip is mounted, and a lead electrically connected to the semiconductor chip, at least the semiconductor chip, the island, and the lead are connected to a shielding conductor through an insulating layer. A semiconductor device characterized by being covered with a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987042771U JPS63149540U (en) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987042771U JPS63149540U (en) | 1987-03-23 | 1987-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149540U true JPS63149540U (en) | 1988-10-03 |
Family
ID=30859000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987042771U Pending JPS63149540U (en) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149540U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202466A (en) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | Shielding sheath and shielding electronic device |
-
1987
- 1987-03-23 JP JP1987042771U patent/JPS63149540U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202466A (en) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | Shielding sheath and shielding electronic device |