JPS6192057U - - Google Patents

Info

Publication number
JPS6192057U
JPS6192057U JP1984176333U JP17633384U JPS6192057U JP S6192057 U JPS6192057 U JP S6192057U JP 1984176333 U JP1984176333 U JP 1984176333U JP 17633384 U JP17633384 U JP 17633384U JP S6192057 U JPS6192057 U JP S6192057U
Authority
JP
Japan
Prior art keywords
conductive path
bonding wire
conductive
wire
extended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984176333U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984176333U priority Critical patent/JPS6192057U/ja
Publication of JPS6192057U publication Critical patent/JPS6192057U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による導電路構造を説明する上
面図、第２図は第１図の−線断面図、第３図
は本考案に用いる絶縁被覆した導線を説明する断
面図、第４図は従来の導電路構造を説明する上面
図、第５図は第４図の−線断面図、第６図は
従来用いていたボンデイングワイヤーを説明する
断面図である。 主な図番の説明、２は第１の導電路、３は第２
の導電路、５は絶縁被覆した導線である。 FIG. 1 is a top view illustrating the conductive path structure according to the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 5 is a top view illustrating a conventional conductive path structure, FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a sectional view illustrating a conventionally used bonding wire. Explanation of main drawing numbers, 2 is the first conductive path, 3 is the second
The conductive path 5 is an insulated conducting wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に設けた第１の導電路と第２の導電
路とが交叉する際に一方の導電路を切欠いて他方
の導電路を延在させ前記一方の導電路をボンデイ
ングワイヤーで接続する混成集積回路の導電路構
造において、前記ボンデイングワイヤーとして絶
縁被覆した導線を用いることを特徴とする混成集
積回路の導電路構造。 When a first conductive path and a second conductive path provided on an insulating substrate intersect, one conductive path is cut out, the other conductive path is extended, and the first conductive path is connected with a bonding wire. 1. A conductive path structure for a hybrid integrated circuit, characterized in that the bonding wire is an insulated conductive wire.
JP1984176333U 1984-11-20 1984-11-20 Pending JPS6192057U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984176333U JPS6192057U (en) 1984-11-20 1984-11-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984176333U JPS6192057U (en) 1984-11-20 1984-11-20

Publications (1)

Publication Number Publication Date
JPS6192057U true JPS6192057U (en) 1986-06-14

Family

ID=30733932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984176333U Pending JPS6192057U (en) 1984-11-20 1984-11-20

Country Status (1)

Country Link
JP (1) JPS6192057U (en)

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