JPS6251749U - - Google Patents
Info
- Publication number
- JPS6251749U JPS6251749U JP14195185U JP14195185U JPS6251749U JP S6251749 U JPS6251749 U JP S6251749U JP 14195185 U JP14195185 U JP 14195185U JP 14195185 U JP14195185 U JP 14195185U JP S6251749 U JPS6251749 U JP S6251749U
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- resin protective
- semiconductor chip
- semiconductor
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
（図面） 第１図はこの考案の半導体装置の一
実施例を示す断面図、第２図は従来の半導体装置
を示す断面図である。
１１……半導体チツプ、１２……電極、１４…
…金属細線、１６……第１の樹脂保護膜、１７…
…第２の樹脂保護膜。
(Drawings) FIG. 1 is a sectional view showing an embodiment of the semiconductor device of this invention, and FIG. 2 is a sectional view showing a conventional semiconductor device. 11...Semiconductor chip, 12...Electrode, 14...
...Thin metal wire, 16...First resin protective film, 17...
...Second resin protective film.
Claims (1)
され、かつ半導体チツプの表面上を樹脂保護膜で
覆つた半導体装置において、 (b) 前記半導体チツプの表面上に薄く塗布され
た第１の樹脂保護膜と、 (c) この第１の樹脂保護膜上に塗布された独立
気泡率の高いスポンジ状発泡体の第２の樹脂保護
膜とを有することを特徴とする半導体装置。[Claims for Utility Model Registration] (a) A semiconductor device in which thin metal wires are connected to electrodes on the surface of a semiconductor chip, and the surface of the semiconductor chip is covered with a resin protective film, (b) (c) a second resin protective film made of a spongy foam with a high closed cell ratio and coated on the first resin protective film; semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195185U JPS6251749U (en) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195185U JPS6251749U (en) | 1985-09-19 | 1985-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6251749U true JPS6251749U (en) | 1987-03-31 |
Family
ID=31050216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14195185U Pending JPS6251749U (en) | 1985-09-19 | 1985-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251749U (en) |
-
1985
- 1985-09-19 JP JP14195185U patent/JPS6251749U/ja active Pending
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