JPS6155351U - - Google Patents

Info

Publication number
JPS6155351U
JPS6155351U JP14057584U JP14057584U JPS6155351U JP S6155351 U JPS6155351 U JP S6155351U JP 14057584 U JP14057584 U JP 14057584U JP 14057584 U JP14057584 U JP 14057584U JP S6155351 U JPS6155351 U JP S6155351U
Authority
JP
Japan
Prior art keywords
sides
lead wires
semiconductor
semiconductor piece
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14057584U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14057584U priority Critical patent/JPS6155351U/ja
Publication of JPS6155351U publication Critical patent/JPS6155351U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の外形図、第2図は
その断面図、第3図は第1、第2図に示したリー
ド線のフオーミング時の状態を示す正面図、第4
図は異なる実施例におけるリード線の正面図であ
る。 1:太いリード線、2:細いリード線、3:樹
脂体、4:ダイオードチツプ。
Fig. 1 is an external view of one embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is a front view showing the state of the lead wire shown in Figs. 1 and 2 during forming, and Fig. 4
The figure is a front view of a lead wire in a different embodiment. 1: thick lead wire, 2: thin lead wire, 3: resin body, 4: diode chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体片の両面にそれぞれ接続されたリード線
が半導体片を封止する絶縁体より両側に引き出さ
れて端子を形成するものにおいてリード線が異な
る太さを有することを特徴とする半導体素子。
1. A semiconductor element in which lead wires connected to both sides of a semiconductor piece are drawn out from an insulator sealing the semiconductor piece to both sides to form terminals, and the lead wires have different thicknesses.
JP14057584U 1984-09-17 1984-09-17 Pending JPS6155351U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14057584U JPS6155351U (en) 1984-09-17 1984-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14057584U JPS6155351U (en) 1984-09-17 1984-09-17

Publications (1)

Publication Number Publication Date
JPS6155351U true JPS6155351U (en) 1986-04-14

Family

ID=30698931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14057584U Pending JPS6155351U (en) 1984-09-17 1984-09-17

Country Status (1)

Country Link
JP (1) JPS6155351U (en)

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