JPS6188253U - - Google Patents

Info

Publication number
JPS6188253U
JPS6188253U JP17286184U JP17286184U JPS6188253U JP S6188253 U JPS6188253 U JP S6188253U JP 17286184 U JP17286184 U JP 17286184U JP 17286184 U JP17286184 U JP 17286184U JP S6188253 U JPS6188253 U JP S6188253U
Authority
JP
Japan
Prior art keywords
lead wire
resin
header
held
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17286184U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17286184U priority Critical patent/JPS6188253U/ja
Publication of JPS6188253U publication Critical patent/JPS6188253U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例において用いられる
リード線の断面図、第2図は従来の樹脂封止半導
体素子の断面図、第3図は従来の半導体素子に用
いられたダブルヘツダリード線の断面図である。 1:半導体片、3:頭部、31:突出部、6:
樹脂、9:リード線。
Figure 1 is a sectional view of a lead wire used in an embodiment of the present invention, Figure 2 is a sectional view of a conventional resin-sealed semiconductor element, and Figure 3 is a double header lead used in a conventional semiconductor element. FIG. 1: Semiconductor piece, 3: Head, 31: Projection, 6:
Resin, 9: Lead wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヘツダ加工されたリード線の一端の頭部の間に
半導体片が保持されるものにおいて、リード線の
頭部の周縁部にリード線の他端方向への突出部を
有することを特徴とする樹脂封止型半導体素子。
A resin in which a semiconductor piece is held between the head portions of one end of the lead wire processed into a header, the resin having a protrusion toward the other end of the lead wire at the peripheral edge of the head portion of the lead wire. Sealed semiconductor device.
JP17286184U 1984-11-14 1984-11-14 Pending JPS6188253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17286184U JPS6188253U (en) 1984-11-14 1984-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17286184U JPS6188253U (en) 1984-11-14 1984-11-14

Publications (1)

Publication Number Publication Date
JPS6188253U true JPS6188253U (en) 1986-06-09

Family

ID=30730520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17286184U Pending JPS6188253U (en) 1984-11-14 1984-11-14

Country Status (1)

Country Link
JP (1) JPS6188253U (en)

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