JPS6329938U - - Google Patents

Info

Publication number
JPS6329938U
JPS6329938U JP12188786U JP12188786U JPS6329938U JP S6329938 U JPS6329938 U JP S6329938U JP 12188786 U JP12188786 U JP 12188786U JP 12188786 U JP12188786 U JP 12188786U JP S6329938 U JPS6329938 U JP S6329938U
Authority
JP
Japan
Prior art keywords
section
cross
semiconductor
terminals
same size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12188786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12188786U priority Critical patent/JPS6329938U/ja
Publication of JPS6329938U publication Critical patent/JPS6329938U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の保護膜形成工程を
示す断面図、第２図は従来のダイオードの保護膜
形成工程を示す断面図である。 １：ダイオードチツプ、２：リード、３：ヘツ
ダ部、４：はんだ、５：保護膜、６：パツシベー
シヨン材塗布円盤。 FIG. 1 is a cross-sectional view showing the process of forming a protective film according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the process of forming a protective film of a conventional diode. 1: Diode chip, 2: Lead, 3: Header part, 4: Solder, 5: Protective film, 6: Passivation material coating disk.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素体の両面に端子と接続される電極部材
が固着されるものにおいて、電極部材が素体側に
ある素体横断面と同一寸法、形状の横断面を有す
る部分と該部分の外側にあるより大きい横断面を
有する部分とを備えたことを特徴とする半導体装
置。 In a device in which electrode members connected to terminals are fixed to both sides of a semiconductor element, there is a part where the electrode member has a cross section of the same size and shape as the cross section of the element on the element side, and a part on the outside of the part. 1. A semiconductor device comprising: a portion having a large cross section.
JP12188786U 1986-08-08 1986-08-08 Pending JPS6329938U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12188786U JPS6329938U (en) 1986-08-08 1986-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12188786U JPS6329938U (en) 1986-08-08 1986-08-08

Publications (1)

Publication Number Publication Date
JPS6329938U true JPS6329938U (en) 1988-02-27

Family

ID=31011568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12188786U Pending JPS6329938U (en) 1986-08-08 1986-08-08

Country Status (1)

Country Link
JP (1) JPS6329938U (en)

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