JPH0244330U - - Google Patents

Info

Publication number
JPH0244330U
JPH0244330U JP12304988U JP12304988U JPH0244330U JP H0244330 U JPH0244330 U JP H0244330U JP 12304988 U JP12304988 U JP 12304988U JP 12304988 U JP12304988 U JP 12304988U JP H0244330 U JPH0244330 U JP H0244330U
Authority
JP
Japan
Prior art keywords
insulating film
organic insulating
resin
semiconductor device
metal thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12304988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12304988U priority Critical patent/JPH0244330U/ja
Publication of JPH0244330U publication Critical patent/JPH0244330U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による樹脂封止型半導体装置の
縦断面図、第２図は従来の構造の樹脂封止型半導
体装置の縦断面図である。 １……半導体素子、２……金属薄膜、３，３′
……有機物絶縁膜、４……内部リード、５……外
部リード、６……金属細線、７……エポキシ樹脂
組成物。 FIG. 1 is a longitudinal sectional view of a resin-sealed semiconductor device according to the present invention, and FIG. 2 is a longitudinal sectional view of a resin-sealed semiconductor device having a conventional structure. 1... Semiconductor element, 2... Metal thin film, 3, 3'
... Organic insulating film, 4 ... Internal lead, 5 ... External lead, 6 ... Fine metal wire, 7 ... Epoxy resin composition.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子載置部が内部リード上に固定された
有機物絶縁膜と有機物絶縁膜上に設けられた金属
薄膜とでなることを特徴とする樹脂封止型半導体
装置。 1. A resin-sealed semiconductor device characterized in that a semiconductor element mounting portion comprises an organic insulating film fixed on an internal lead and a metal thin film provided on the organic insulating film.
JP12304988U 1988-09-19 1988-09-19 Pending JPH0244330U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12304988U JPH0244330U (en) 1988-09-19 1988-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12304988U JPH0244330U (en) 1988-09-19 1988-09-19

Publications (1)

Publication Number Publication Date
JPH0244330U true JPH0244330U (en) 1990-03-27

Family

ID=31371549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12304988U Pending JPH0244330U (en) 1988-09-19 1988-09-19

Country Status (1)

Country Link
JP (1) JPH0244330U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61240B2 (en) * 1981-12-08 1986-01-07 Tokyo Shibaura Electric Co
JPS625643B2 (en) * 1982-08-31 1987-02-05 Anton Shutainetsukaa Mas Fab Gmbh

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61240B2 (en) * 1981-12-08 1986-01-07 Tokyo Shibaura Electric Co
JPS625643B2 (en) * 1982-08-31 1987-02-05 Anton Shutainetsukaa Mas Fab Gmbh

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