JPS63172149U - - Google Patents
Info
- Publication number
- JPS63172149U JPS63172149U JP6564587U JP6564587U JPS63172149U JP S63172149 U JPS63172149 U JP S63172149U JP 6564587 U JP6564587 U JP 6564587U JP 6564587 U JP6564587 U JP 6564587U JP S63172149 U JPS63172149 U JP S63172149U
- Authority
- JP
- Japan
- Prior art keywords
- gold
- mounting base
- lead frame
- semiconductor device
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
Description
第１図は本考案の一実施例の要部平面図、第２
図は第１図の一本のリードの内端部を示す断面図
、第３図は本考案の他の実施例に係る一本のリー
ドの金属細線ボンデイング部の近傍を示す断面図
、第４図は従来のリードフレームの要部平面図で
ある。
１……半導体素子搭載台部、２……吊りリード
、３……リード、４……円形のくぼみ、５……リ
ング状のくぼみ、６……金または銀メツキ部。
Figure 1 is a plan view of the main parts of an embodiment of the present invention, Figure 2
The figures are a cross-sectional view showing the inner end of one lead in FIG. 1, FIG. 3 is a cross-sectional view showing the vicinity of the thin metal wire bonding part of one lead according to another embodiment of the present invention, and FIG. The figure is a plan view of essential parts of a conventional lead frame. 1...Semiconductor element mounting base part, 2...Hanging lead, 3...Lead, 4...Circular depression, 5...Ring-shaped depression, 6...Gold or silver plating part.
Claims (1)
配置された多数のリードとを有する半導体装置用
リードフレームにおいて、前記リード内端部近傍
に、金属細線圧着用の金または銀のメツキを施す
領域を限定するくぼみが設けられ、この限定領域
内に金または銀のメツキが施されていることを特
徴とする半導体装置用リードフレーム。 In a lead frame for a semiconductor device having a semiconductor element mounting base and a large number of leads arranged around the mounting base, gold or silver plating for crimping thin metal wires is applied near the inner ends of the leads. A lead frame for a semiconductor device, characterized in that a recess is provided to define a region, and the limited region is plated with gold or silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6564587U JPS63172149U (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6564587U JPS63172149U (en) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172149U true JPS63172149U (en) | 1988-11-09 |
Family
ID=30902912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6564587U Pending JPS63172149U (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014099534A (en) * | 2012-11-15 | 2014-05-29 | Dainippon Printing Co Ltd | Lead frame and manufacturing method of the same, and semiconductor device and manufacturing method of the same |
| JP2015153987A (en) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | mold package |
-
1987
- 1987-04-28 JP JP6564587U patent/JPS63172149U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014099534A (en) * | 2012-11-15 | 2014-05-29 | Dainippon Printing Co Ltd | Lead frame and manufacturing method of the same, and semiconductor device and manufacturing method of the same |
| JP2015153987A (en) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | mold package |
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