JPH0233442U - - Google Patents
Info
- Publication number
- JPH0233442U JPH0233442U JP11266988U JP11266988U JPH0233442U JP H0233442 U JPH0233442 U JP H0233442U JP 11266988 U JP11266988 U JP 11266988U JP 11266988 U JP11266988 U JP 11266988U JP H0233442 U JPH0233442 U JP H0233442U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- metal support
- main surface
- resin
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
Description
第１図はこの考案の一実施例の樹脂封止型半導
体装置の断面図、第２図は第１図の平面図である
。第３図は従来の樹脂封止型半導体装置の断面図
である。
４，５……リード端子、６……半導体ペレツト
、７，８……ワイヤ、２１……金属支持板、２１
ａ……半導体ペレツト搭載部分、２１ｂ……孔の
近傍部分、２２……孔、２４……絶縁樹脂被覆体
。
FIG. 1 is a sectional view of a resin-sealed semiconductor device according to an embodiment of the invention, and FIG. 2 is a plan view of FIG. 1. FIG. 3 is a sectional view of a conventional resin-sealed semiconductor device. 4, 5... Lead terminal, 6... Semiconductor pellet, 7, 8... Wire, 21... Metal support plate, 21
a... Semiconductor pellet mounting portion, 21b... Portion near the hole, 22... Hole, 24... Insulating resin coating.
Claims (1)
に切欠部又は孔を有し、他端にはリード端子とな
る部分を有している金属支持板と、前記リード端
子と絶縁されたリード端子と、前記金属支持板の
一方の主表面上に搭載された半導体チツプと、前
記金属支持板とは絶縁されたリード端子と前記半
導体リツプを電気的に接続するワイヤと、前記金
属支持板、前記半導体チツプ及び前記ワイヤを被
覆する絶縁樹脂被覆体から成り、且つ前記金属支
持板の一方の主表面を被う樹脂被覆部の厚さが他
方の主表面の樹脂被覆部よりも厚くなるように形
成され、且つ前記切欠部又は孔の部分に取付用の
孔を有するように前記樹脂被覆体が形成された樹
脂封止型半導体装置において、 前記一端近傍から前記半導体ペレツト搭載部ま
での前記一方主表面側の樹脂厚が、他方主表面側
の樹脂厚よりも薄くなる様に段差状に加工された
金属支持板を有することを特徴とする樹脂封止型
半導体装置。[Claims for Utility Model Registration] A metal support plate formed to have a heat dissipation function and having a notch or hole near one end and a portion serving as a lead terminal at the other end, and the lead terminal. a lead terminal insulated from the metal support plate; a semiconductor chip mounted on one main surface of the metal support plate; a wire electrically connecting the lead terminal and the semiconductor chip insulated from the metal support plate; The metal support plate is composed of an insulating resin coating covering the semiconductor chip and the wire, and the thickness of the resin coating covering one main surface of the metal support plate is greater than that of the resin coating on the other main surface. In the resin-sealed semiconductor device, the resin coating is formed so as to be thicker and have a mounting hole in the notch or hole, wherein the semiconductor pellet mounting portion is attached from near the one end. A resin-sealed semiconductor device comprising: a metal support plate processed into a stepped shape so that the resin thickness on the one main surface side is thinner than the resin thickness on the other main surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11266988U JPH0233442U (en) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11266988U JPH0233442U (en) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233442U true JPH0233442U (en) | 1990-03-02 |
Family
ID=31351817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11266988U Pending JPH0233442U (en) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244311A (en) * | 1992-07-28 | 1994-09-02 | Nec Corp | Manufacture of semiconductor device |
-
1988
- 1988-08-26 JP JP11266988U patent/JPH0233442U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244311A (en) * | 1992-07-28 | 1994-09-02 | Nec Corp | Manufacture of semiconductor device |