JPH0338647U - - Google Patents
Info
- Publication number
- JPH0338647U JPH0338647U JP9954289U JP9954289U JPH0338647U JP H0338647 U JPH0338647 U JP H0338647U JP 9954289 U JP9954289 U JP 9954289U JP 9954289 U JP9954289 U JP 9954289U JP H0338647 U JPH0338647 U JP H0338647U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- element mounting
- semiconductor
- lead
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例を示す半導体装
置の部分断面図、第２図は従来の半導体装置の断
面図、第３図は第２図の半導体装置におけるリー
ドフレームの平面図、第４図は本考案の第２の実
施例を示す半導体装置の部分断面図、及び第５図
は本考案の第３の実施例を示す半導体装置の部分
断面図である。
１１…リードフレーム、１２…インナーリード
、１３，２２…凹部、１４，２１…絶縁部、１５
…半導体素子、１６…ボンデイングワイヤ。
1 is a partial sectional view of a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a sectional view of a conventional semiconductor device, and FIG. 3 is a plan view of a lead frame in the semiconductor device of FIG. FIG. 4 is a partial sectional view of a semiconductor device showing a second embodiment of the invention, and FIG. 5 is a partial sectional view of a semiconductor device showing a third embodiment of the invention. DESCRIPTION OF SYMBOLS 11... Lead frame, 12... Inner lead, 13, 22... Recessed part, 14, 21... Insulating part, 15
...Semiconductor element, 16...Bonding wire.
Claims (1)
る半導体装置において、 前記リードフレームのインナーリードの内端部
側が凹状に曲げられて形成された素子搭載部と、 前記素子搭載部の前記凹状の内面に設けられ電
気的絶縁性を有する絶縁部と、 前記絶縁部を介して前記素子搭載部に固定され
た前記半導体素子とを、 備えたことを特徴とする半導体装置。 ２ 請求項１記載の半導体装置において、 前記絶縁部を前記インナーリードの上面に突出
して設けた半導体装置。 ３ 請求項１又は２記載の半導体装置において、 前記半導体素子の表面が前記インナーリードの
上面より低くなるように前記素子搭載部を形成し
た半導体装置。[Claims for Utility Model Registration] 1. A semiconductor device in which a semiconductor element is mounted on a lead frame, comprising: an element mounting part formed by concavely bending an inner end side of an inner lead of the lead frame; and the element mounting part. A semiconductor device comprising: an insulating part provided on the concave inner surface of the part and having electrical insulation properties; and the semiconductor element fixed to the element mounting part via the insulating part. 2. The semiconductor device according to claim 1, wherein the insulating portion is provided to protrude from the upper surface of the inner lead. 3. The semiconductor device according to claim 1, wherein the element mounting portion is formed such that the surface of the semiconductor element is lower than the upper surface of the inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9954289U JPH0338647U (en) | 1989-08-25 | 1989-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9954289U JPH0338647U (en) | 1989-08-25 | 1989-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338647U true JPH0338647U (en) | 1991-04-15 |
Family
ID=31648585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9954289U Pending JPH0338647U (en) | 1989-08-25 | 1989-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338647U (en) |
-
1989
- 1989-08-25 JP JP9954289U patent/JPH0338647U/ja active Pending