JPH0170360U - - Google Patents
Info
- Publication number
- JPH0170360U JPH0170360U JP1987164974U JP16497487U JPH0170360U JP H0170360 U JPH0170360 U JP H0170360U JP 1987164974 U JP1987164974 U JP 1987164974U JP 16497487 U JP16497487 U JP 16497487U JP H0170360 U JPH0170360 U JP H0170360U
- Authority
- JP
- Japan
- Prior art keywords
- element mounting
- mounting plate
- electronic circuit
- circuit device
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案に係る電子回路装置の断面図
、第２図は、一般的な電子回路装置のリードフレ
ームより切断分離する前の平面図、第３図は、従
来の電子回路装置の断面図、第４図は、一般的な
電子回路装置の樹脂封止の途中工程断面図である
。
１……第１の樹脂板、２……導電路、３……素
子取付部、４……素子、６，１０……金属細線、
７……リードフレーム、７ａ……素子取付板、７
ｂ……リード線、８……第２の樹脂板、１１……
樹脂。
FIG. 1 is a cross-sectional view of an electronic circuit device according to the present invention, FIG. 2 is a plan view of a conventional electronic circuit device before it is cut and separated from a lead frame, and FIG. 3 is a diagram of a conventional electronic circuit device. The cross-sectional view, FIG. 4, is a cross-sectional view showing an intermediate process of resin sealing of a general electronic circuit device. DESCRIPTION OF SYMBOLS 1... First resin plate, 2... Conductive path, 3... Element mounting part, 4... Element, 6, 10... Metal thin wire,
7...Lead frame, 7a...Element mounting plate, 7
b... Lead wire, 8... Second resin plate, 11...
resin.
Claims (1)
面に素子を取付けた第１の樹脂板を、素子取付板
と素子取付板より離隔して放射状に延びる複数本
のリード線よりなるリードフレームの素子取付板
上に、第２の樹脂板を介して固着し、素子の電極
と導電路及び導電路とリード線とをボンデイング
結線して、素子及びリード線内方端等を樹脂で埋
設封止するようにした電子回路装置において、第
２の樹脂板を、素子取付板よりも大きく形成し、
その側端部をリード線内方端にも固着するように
したことを特徴とする電子回路装置。 A first resin plate with a conductive path and an element mounting portion formed on the upper and lower surfaces and an element mounted on the upper surface is connected to a lead frame consisting of an element mounting plate and a plurality of lead wires extending radially apart from the element mounting plate. It is fixed on the element mounting plate via a second resin plate, the electrodes of the element and the conductive path and the conductive path and the lead wire are connected by bonding, and the inner ends of the element and the lead wire are buried and sealed with resin. In the electronic circuit device, the second resin plate is formed larger than the element mounting plate,
An electronic circuit device characterized in that a side end portion of the electronic circuit device is also fixed to an inner end of a lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164974U JPH0170360U (en) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164974U JPH0170360U (en) | 1987-10-28 | 1987-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170360U true JPH0170360U (en) | 1989-05-10 |
Family
ID=31451041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987164974U Pending JPH0170360U (en) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170360U (en) |
-
1987
- 1987-10-28 JP JP1987164974U patent/JPH0170360U/ja active Pending
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