JPH0229539U - - Google Patents
Info
- Publication number
- JPH0229539U JPH0229539U JP1988107160U JP10716088U JPH0229539U JP H0229539 U JPH0229539 U JP H0229539U JP 1988107160 U JP1988107160 U JP 1988107160U JP 10716088 U JP10716088 U JP 10716088U JP H0229539 U JPH0229539 U JP H0229539U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- inner lead
- semiconductor pellet
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000008188 pellet Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に使用するヒートシンクの斜視
図、第２図は本考案の半導体装置の断面図、第３
図は本考案の他の実施例を示す半導体装置の平面
図、第４図は第３図において溝を有したヒートシ
ンクとインナーリードとの関係を示す図、第５図
は従来の半導体装置に使用するヒートシンクの斜
視図、第６図は従来の半導体装置の断面図である
。
１…リードフレーム、２…ヒートシンク、３…
かしめ部、４…搭載部、５…インナーリード、６
…半導体ペレツト、７…金属細線、８…樹脂、９
…絶縁膜、１０…溝。
Figure 1 is a perspective view of a heat sink used in the present invention, Figure 2 is a sectional view of the semiconductor device of the present invention, and Figure 3 is a perspective view of a heat sink used in the present invention.
The figure is a plan view of a semiconductor device showing another embodiment of the present invention, FIG. 4 is a diagram showing the relationship between the grooved heat sink and the inner lead in FIG. 3, and FIG. FIG. 6 is a sectional view of a conventional semiconductor device. 1...Lead frame, 2...Heat sink, 3...
Caulking part, 4...Mounting part, 5...Inner lead, 6
...Semiconductor pellet, 7...Metal thin wire, 8...Resin, 9
...Insulating film, 10... Groove.
Claims (1)
体ペレツトと、 前記ヒートシンクと空間的に離間したインナー
リードと、 このインナーリードと前記半導体ペレツトを電
気的に接続する金属細線とを樹脂モールドした半
導体装置に於いて、 前記半導体ペレツト搭載部を除いたヒートシン
ク表面に絶縁膜を設けることを特徴とした半導体
装置。 (2) 前記ヒートシンクはアルミニウムより成り
、前記絶縁膜は陽極酸化より形成される請求項第
１項記載の半導体装置。 (3) 板状のヒートシンクと、 このヒートシンクの略中央部に搭載された半導
体ペレツトと、 前記ヒートシンクと空間的に離間したインナー
リードと、 このインナーリードと前記半導体ペレツトを電
気的に接続する金属細線と、 前記半導体ペレツトの搭載部の周囲より前記イ
ンナーリードの先端を越える幅で帯状に形成され
た絶縁体または溝とを具備することを特徴とした
半導体装置。 (4) 前記ヒートシンクはアルミニウムより成り
、前記絶縁膜は陽極酸化より形成される請求項第
３項記載の半導体装置。 (5) 前記溝は、前記インナーリードと接触する
側に傾斜を有した請求項第３項記載の半導体装置
。[Claims for Utility Model Registration] (1) A plate-shaped heat sink, a semiconductor pellet mounted approximately in the center of the heat sink, an inner lead spatially separated from the heat sink, and the inner lead and the semiconductor pellet. 1. A semiconductor device in which a thin metal wire for electrically connecting a semiconductor pellet and a thin metal wire are resin-molded, wherein an insulating film is provided on the surface of the heat sink except for the semiconductor pellet mounting portion. (2) The semiconductor device according to claim 1, wherein the heat sink is made of aluminum, and the insulating film is formed by anodic oxidation. (3) A plate-shaped heat sink, a semiconductor pellet mounted approximately in the center of the heat sink, an inner lead spatially separated from the heat sink, and a thin metal wire electrically connecting the inner lead and the semiconductor pellet. and an insulator or groove formed in a band shape with a width exceeding the tip of the inner lead from the periphery of the mounting portion of the semiconductor pellet. (4) The semiconductor device according to claim 3, wherein the heat sink is made of aluminum, and the insulating film is formed by anodic oxidation. (5) The semiconductor device according to claim 3, wherein the groove has a slope on the side that contacts the inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107160U JPH0229539U (en) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107160U JPH0229539U (en) | 1988-08-12 | 1988-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229539U true JPH0229539U (en) | 1990-02-26 |
Family
ID=31341324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988107160U Pending JPH0229539U (en) | 1988-08-12 | 1988-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229539U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994271A (en) * | 1973-01-10 | 1974-09-06 |
-
1988
- 1988-08-12 JP JP1988107160U patent/JPH0229539U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994271A (en) * | 1973-01-10 | 1974-09-06 |