JPH0270459U - - Google Patents
Info
- Publication number
- JPH0270459U JPH0270459U JP15039488U JP15039488U JPH0270459U JP H0270459 U JPH0270459 U JP H0270459U JP 15039488 U JP15039488 U JP 15039488U JP 15039488 U JP15039488 U JP 15039488U JP H0270459 U JPH0270459 U JP H0270459U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- wiring board
- sides
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図Ａ乃至Ｈは本考案の一実施例を製造順に
示した縦断面図、第２図は従来例の縦断面図であ
る。
１……金属薄板、２……金属ケース（１をしぼ
り加工したもの）、３……基材、４……配線導体
、５……ミーリングキヤビテイ、６……プレス加
工孔、７，１１……半導体素子、８，１２……ボ
ンデイングワイヤ、９，１３……樹脂止め枠、１
０，１４……封止樹脂。
1A to 1H are longitudinal sectional views showing an embodiment of the present invention in the order of manufacture, and FIG. 2 is a longitudinal sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1...Thin metal plate, 2...Metal case (squeezed from 1), 3...Base material, 4...Wiring conductor, 5...Milling cavity, 6...Pressed hole, 7, 11... ...Semiconductor element, 8, 12... Bonding wire, 9, 13... Resin retaining frame, 1
0,14...Sealing resin.
Claims (1)
装する構造の半導体装置において、前記プリント
回路配線基板の半導体素子搭載位置に貫通孔を設
け、該貫通孔の中間位置に金属製の薄板を埋め込
み、その金属薄板の両面上に半導体素子をそれぞ
れ搭載したことを特徴とする半導体装置。 In a semiconductor device having a structure in which semiconductor elements are mounted on both sides of a printed circuit wiring board, a through hole is provided at the semiconductor element mounting position of the printed circuit wiring board, a thin metal plate is embedded in the middle position of the through hole, and the metal A semiconductor device characterized by mounting semiconductor elements on both sides of a thin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15039488U JPH0270459U (en) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15039488U JPH0270459U (en) | 1988-11-18 | 1988-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270459U true JPH0270459U (en) | 1990-05-29 |
Family
ID=31423498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15039488U Pending JPH0270459U (en) | 1988-11-18 | 1988-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270459U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284653A (en) * | 1991-03-13 | 1992-10-09 | Kyocera Corp | Semiconductor element containing package |
-
1988
- 1988-11-18 JP JP15039488U patent/JPH0270459U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284653A (en) * | 1991-03-13 | 1992-10-09 | Kyocera Corp | Semiconductor element containing package |