JPS63167735U - - Google Patents
Info
- Publication number
- JPS63167735U JPS63167735U JP6121687U JP6121687U JPS63167735U JP S63167735 U JPS63167735 U JP S63167735U JP 6121687 U JP6121687 U JP 6121687U JP 6121687 U JP6121687 U JP 6121687U JP S63167735 U JPS63167735 U JP S63167735U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- metal plate
- circuit element
- sealing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案の実施例の樹脂で封
止を行う前の斜視図及び断面図であり、第３図及
び第４図は従来の実施例の樹脂で封止を行う前の
斜視図及び断面図である。
１……回路基板、２……集積回路素子、３ａ…
…ノーマル端子、３ｂ……テスト端子、３ｃ……
ノーマル端子又はテスト端子、４……ボンデイン
グワイヤー、５……封止枠、６……金属板、７…
…レジスト、８ａ……ノーマル端子のメタライズ
パターン、８ｂ……テスト端子のメタライズパタ
ーン、９……測定治具のブローブ、１０……樹脂
。
1 and 2 are a perspective view and a sectional view before sealing with the resin of the embodiment of the present invention, and FIGS. 3 and 4 are before sealing with the resin of the conventional embodiment. FIG. 2 is a perspective view and a cross-sectional view. 1... Circuit board, 2... Integrated circuit element, 3a...
...Normal terminal, 3b...Test terminal, 3c...
Normal terminal or test terminal, 4... bonding wire, 5... sealing frame, 6... metal plate, 7...
...Resist, 8a...Metallization pattern of normal terminal, 8b...Metallization pattern of test terminal, 9...Probe of measurement jig, 10...Resin.
Claims (1)
子を封止枠で囲い、枠の内側を樹脂で封止する集
積回路装置において、金属製の薄板（以降、金属
板と記す）が封止枠の上面の一部分を覆うように
固定されており、金属板に集積回路素子上の端子
の一部をボンデイングすることを特徴とする集積
回路装置。 In an integrated circuit device in which an integrated circuit element is mounted on a circuit board, the integrated circuit element is surrounded by a sealing frame, and the inside of the frame is sealed with resin, a thin metal plate (hereinafter referred to as metal plate) is used as the sealing frame. An integrated circuit device, characterized in that the integrated circuit device is fixed so as to cover a portion of the upper surface of the integrated circuit device, and a portion of the terminals on the integrated circuit element are bonded to the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121687U JPH0414934Y2 (en) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121687U JPH0414934Y2 (en) | 1987-04-21 | 1987-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63167735U true JPS63167735U (en) | 1988-11-01 |
| JPH0414934Y2 JPH0414934Y2 (en) | 1992-04-03 |
Family
ID=30894345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6121687U Expired JPH0414934Y2 (en) | 1987-04-21 | 1987-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414934Y2 (en) |
-
1987
- 1987-04-21 JP JP6121687U patent/JPH0414934Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414934Y2 (en) | 1992-04-03 |