JPS625646U - - Google Patents
Info
- Publication number
- JPS625646U JPS625646U JP9685585U JP9685585U JPS625646U JP S625646 U JPS625646 U JP S625646U JP 9685585 U JP9685585 U JP 9685585U JP 9685585 U JP9685585 U JP 9685585U JP S625646 U JPS625646 U JP S625646U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- metal plate
- case
- peripheral edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は従来構造図、第２図は本考案装置に適
用するケースの断面図、金属板の平面図及び側面
図である。図において１ａ，１ｂは半導体チツプ
、２ａ，２ｂは電極、３ａ，３ｂはリード端子、
４はケース、４ａは周縁部、４ｂは底部（金属板
）、４ｂは突起、Ｇは溝、４ｃは筒状部（取付部
）、５は絶縁シート、６は封止樹脂である。
FIG. 1 is a conventional structural diagram, and FIG. 2 is a sectional view of a case applied to the device of the present invention, and a plan view and a side view of a metal plate. In the figure, 1a and 1b are semiconductor chips, 2a and 2b are electrodes, 3a and 3b are lead terminals,
4 is a case, 4a is a peripheral portion, 4b is a bottom portion (metal plate), 4b is a protrusion, G is a groove, 4c is a cylindrical portion (attachment portion), 5 is an insulating sheet, and 6 is a sealing resin.
Claims (1)
てリード端子を設けた半導体回路素体をケースに
収納し、これを樹脂封止するようにした樹脂封止
型半導体装置において、前記ケースは底部を金属
板、周縁部を樹脂材で形成すると共に前記底部に
はこれを貫通する如く前記樹脂材により形成され
た外部取付用の筒状部を備え、且つ前記金属板表
面に前記周縁部と筒状部に跨がる樹脂導入用の溝
を設けたことを特徴とする樹脂封止型半導体装置
。 In a resin-sealed semiconductor device in which a semiconductor circuit element, in which a semiconductor element is fixed between electrodes, required circuits are connected, and lead terminals are provided, is housed in a case, and this is sealed with resin, the case has a bottom portion. is a metal plate, a peripheral edge part is formed of a resin material, and the bottom part is provided with a cylindrical part for external attachment formed of the resin material so as to pass through the bottom part, and the peripheral edge part and the cylinder are formed on the surface of the metal plate. 1. A resin-sealed semiconductor device characterized by having a groove for introducing a resin that extends over a shaped portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685585U JPH0338837Y2 (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685585U JPH0338837Y2 (en) | 1985-06-26 | 1985-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625646U true JPS625646U (en) | 1987-01-14 |
| JPH0338837Y2 JPH0338837Y2 (en) | 1991-08-15 |
Family
ID=30963103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9685585U Expired JPH0338837Y2 (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338837Y2 (en) |
-
1985
- 1985-06-26 JP JP9685585U patent/JPH0338837Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0338837Y2 (en) | 1991-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS625646U (en) | ||
| JPS61182036U (en) | ||
| JPS619840U (en) | Resin-encapsulated semiconductor device | |
| JPS62140744U (en) | ||
| JPH0369232U (en) | ||
| JPH0336478U (en) | ||
| JPS60192433U (en) | Electrolytic capacitor | |
| JPS6242254U (en) | ||
| JPS6194356U (en) | ||
| JPH0176040U (en) | ||
| JPH0476046U (en) | ||
| JPS6234441U (en) | ||
| JPH02101544U (en) | ||
| JPS58138352U (en) | Lead terminal for semiconductor package | |
| JPS639154U (en) | ||
| JPH01120334U (en) | ||
| JPH0211341U (en) | ||
| JPS6066037U (en) | Resin-encapsulated semiconductor device | |
| JPS6380844U (en) | ||
| JPH0373444U (en) | ||
| JPS62160548U (en) | ||
| JPS63201334U (en) | ||
| JPH0170360U (en) | ||
| JPS6284928U (en) | ||
| JPS63167735U (en) |