JPH0373444U - - Google Patents
Info
- Publication number
- JPH0373444U JPH0373444U JP1989133882U JP13388289U JPH0373444U JP H0373444 U JPH0373444 U JP H0373444U JP 1989133882 U JP1989133882 U JP 1989133882U JP 13388289 U JP13388289 U JP 13388289U JP H0373444 U JPH0373444 U JP H0373444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- opening
- base film
- width
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000565 sealant Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例における半導体チ
ツプの実装構造の要部を示す平面図、第２図は第
１図の−線に沿う断面図、第３図は従来の半
導体チツプの実装構造の一例を示す一部の平面図
、第４図は第３図の−線に沿う断面図である
。
１……ベースフイルム、２……開口、３……半
導体チツプ、４……バンプ電極、５……フインガ
リード、６……封止剤。
FIG. 1 is a plan view showing the main parts of a semiconductor chip mounting structure in an embodiment of this invention, FIG. 2 is a sectional view taken along the - line in FIG. 1, and FIG. 3 is a conventional semiconductor chip mounting structure. FIG. 4 is a sectional view taken along the - line in FIG. 3. DESCRIPTION OF SYMBOLS 1... Base film, 2... Opening, 3... Semiconductor chip, 4... Bump electrode, 5... Finger lead, 6... Sealing agent.
Claims (1)
プが配置され、かつこの半導体チツプのバンプ電
極に前記ベースフイルムの開口の部分に突出して
形成されたフインガリードが接合され、さらにこ
の接合部分及び前記半導体チツプのバンプ電極を
有する面が樹脂からなる封止剤で封止された半導
体チツプの封止構造において、 前記ベースフイルムの開口の開口壁部と前記半
導体チツプの外周部との間における前記フイガリ
ードの幅を前記半導体チツプのバンプ電極と接合
された部分における前記フインガリードの幅より
も広くしたことを特徴とする半導体チツプの封止
構造。[Claims for Utility Model Registration] A semiconductor chip is disposed in an opening formed in a base film, and finger leads formed protruding from the opening in the base film are bonded to bump electrodes of the semiconductor chip, and In a semiconductor chip sealing structure in which a bonding portion and a surface of the semiconductor chip having bump electrodes are sealed with a sealant made of resin, the opening wall portion of the opening in the base film and the outer peripheral portion of the semiconductor chip 1. A sealing structure for a semiconductor chip, characterized in that the width of the finger lead between the chips is wider than the width of the finger lead at a portion joined to a bump electrode of the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133882U JPH0373444U (en) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133882U JPH0373444U (en) | 1989-11-20 | 1989-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373444U true JPH0373444U (en) | 1991-07-24 |
Family
ID=31681268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989133882U Pending JPH0373444U (en) | 1989-11-20 | 1989-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373444U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023491A (en) * | 2008-06-16 | 2010-02-04 | Canon Inc | Liquid ejection recording head |
-
1989
- 1989-11-20 JP JP1989133882U patent/JPH0373444U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023491A (en) * | 2008-06-16 | 2010-02-04 | Canon Inc | Liquid ejection recording head |
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