JPH0356144U - - Google Patents
Info
- Publication number
- JPH0356144U JPH0356144U JP11627489U JP11627489U JPH0356144U JP H0356144 U JPH0356144 U JP H0356144U JP 11627489 U JP11627489 U JP 11627489U JP 11627489 U JP11627489 U JP 11627489U JP H0356144 U JPH0356144 U JP H0356144U
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- ceramic
- semiconductor chip
- gold
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Description
第１図ａおよびｂは本考案の一実施例を示す部
分斜視図およびそのＡ−Ａ′断面図、第２図ａお
よびｂはそれぞれ従来の超高周波ＩＣ用セラミツ
ク・パツケージの部分斜視図およびそのＡ−Ａ′
断面図である。
１……セラミツク基板、２……セラミツク封止
壁部材、３……セラミツク封止キヤツプ部材、４
……高融点金属信号配線、５……外部リード、６
……金メツキ信号配線、７……半導体チツプ、８
……ボンデイング線、９……接地導体、１０……
外部リード接着面、１１……半導体チツプの載置
部材。
1A and 1B are a partial perspective view and an AA' sectional view thereof showing an embodiment of the present invention, and FIGS. 2A and 2B are a partial perspective view and a sectional view thereof, respectively, of a conventional ceramic package for ultra-high frequency IC. A-A'
FIG. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Ceramic sealing wall member, 3... Ceramic sealing cap member, 4
...High melting point metal signal wiring, 5...External lead, 6
...Gold-plated signal wiring, 7...Semiconductor chip, 8
...Bonding wire, 9...Grounding conductor, 10...
External lead adhesion surface, 11...Semiconductor chip mounting member.
Claims (1)
配線および接地導体をそれぞれ形成するセラミツ
ク基板と、前記半導体チツプを信号配線と共に気
密封着するセラミツク封止壁部材およびセラミツ
ク封止キヤツプ部材とを含み、前記信号配線は前
記セラミツク封止壁部材の接着面で覆われる高融
点金属信号配線部の線幅を気密封着室内の金メツ
キ信号配線部の線幅より大きく、また、裏面の接
地導体は上表面の該金メツキ信号配線の布線範囲
に限定されてそれぞれ設けられることを特徴とす
る超高周波ＩＣ用パツケージ。 The ceramic substrate includes a ceramic substrate on which signal wiring and a ground conductor for the semiconductor chip are respectively formed on the upper and lower surfaces thereof, and a ceramic sealing wall member and a ceramic sealing cap member that hermetically seals the semiconductor chip together with the signal wiring. The line width of the high-melting point metal signal wiring portion covered by the adhesive surface of the ceramic sealing wall member is larger than the line width of the gold-plated signal wiring portion in the hermetic sealing chamber, and the ground conductor on the back side is A package for an ultra-high frequency IC, characterized in that each package is provided within a wiring range of gold-plated signal wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11627489U JPH0356144U (en) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11627489U JPH0356144U (en) | 1989-10-02 | 1989-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356144U true JPH0356144U (en) | 1991-05-30 |
Family
ID=31664557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11627489U Pending JPH0356144U (en) | 1989-10-02 | 1989-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356144U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009166901A (en) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | Stick type package |
-
1989
- 1989-10-02 JP JP11627489U patent/JPH0356144U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009166901A (en) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | Stick type package |
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