JPH02131353U - - Google Patents
Info
- Publication number
- JPH02131353U JPH02131353U JP4036889U JP4036889U JPH02131353U JP H02131353 U JPH02131353 U JP H02131353U JP 4036889 U JP4036889 U JP 4036889U JP 4036889 U JP4036889 U JP 4036889U JP H02131353 U JPH02131353 U JP H02131353U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- alumina ceramic
- metallized portion
- led out
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の半導体装置の一実施例を示
す要部断面図、第２図はこの考案の他の実施例を
示す要部断面図、第３図は従来例を示す要部断面
図である。
図において、１はベリリアセラミツク、２はア
ルミナセラミツク、２ａはスルーホール、４はキ
ヤツプ、５，５ａ，５ｂはメタライズ部、６はリ
ード端子、７はろう材、８は半田材、９はトラン
ジスタチツプである。なお、各図中の同一符号は
同一または相当部分を示す。
FIG. 1 is a cross-sectional view of a main part showing one embodiment of a semiconductor device of this invention, FIG. 2 is a cross-sectional view of a main part showing another embodiment of this invention, and FIG. 3 is a cross-sectional view of a main part showing a conventional example. It is. In the figure, 1 is beryllia ceramic, 2 is alumina ceramic, 2a is a through hole, 4 is a cap, 5, 5a, 5b are metallized parts, 6 is a lead terminal, 7 is a brazing material, 8 is a solder material, 9 is a transistor It's a chip. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
半導体チツプが搭載され、この半導体チツプとワ
イヤボンデイングされるとともに、リード端子が
導出されるメタライズ部を上面に備えたアルミナ
セラミツクが前記セラミツク上に載置され、前記
アルミナセラミツク上にキヤツプをハーメチツク
封止した半導体装置において、前記アルミナセラ
ミツクにスルーホールを設け、前記アルミナセラ
ミツク上面のメタライズ部とは反対面に前記リー
ド端子を導出したことを特徴とする半導体装置。 A semiconductor chip is mounted on a metallized portion formed on the upper surface of the ceramic, wire bonded to the semiconductor chip, and an alumina ceramic having a metallized portion on its upper surface from which lead terminals are led out is placed on the ceramic, A semiconductor device in which a cap is hermetically sealed on the alumina ceramic, characterized in that a through hole is provided in the alumina ceramic, and the lead terminal is led out to a surface opposite to a metallized portion on the top surface of the alumina ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036889U JPH0710495Y2 (en) | 1989-04-04 | 1989-04-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036889U JPH0710495Y2 (en) | 1989-04-04 | 1989-04-04 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02131353U true JPH02131353U (en) | 1990-10-31 |
| JPH0710495Y2 JPH0710495Y2 (en) | 1995-03-08 |
Family
ID=31550097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4036889U Expired - Lifetime JPH0710495Y2 (en) | 1989-04-04 | 1989-04-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710495Y2 (en) |
-
1989
- 1989-04-04 JP JP4036889U patent/JPH0710495Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710495Y2 (en) | 1995-03-08 |
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