JPH0281043U - - Google Patents
Info
- Publication number
- JPH0281043U JPH0281043U JP15943288U JP15943288U JPH0281043U JP H0281043 U JPH0281043 U JP H0281043U JP 15943288 U JP15943288 U JP 15943288U JP 15943288 U JP15943288 U JP 15943288U JP H0281043 U JPH0281043 U JP H0281043U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- chip
- frame
- lead
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体パツケージ構造の実施
例を示す断面図、第２図はＰＧＡタイプの他の実
施例を示す断面図、第３図は従来例を示す断面図
である。
図において、１はフレーム、３はＩＣチツプ、
４はリツド、５，５′はリード、１０はｖｉａ、
１０′は導体パターンである。
FIG. 1 is a sectional view showing an embodiment of the semiconductor package structure of the present invention, FIG. 2 is a sectional view showing another embodiment of the PGA type, and FIG. 3 is a sectional view showing a conventional example. In the figure, 1 is a frame, 3 is an IC chip,
4 is lid, 5 and 5' are leads, 10 is via,
10' is a conductor pattern.
Claims (1)
れと同一寸法でセラミツクから成るリツド４を該
ＩＣチツプ３等を封止するように接合し、 該リツド４の下面にリード５又は５′を取付け
、リツド４の内部にリード５又は５〓に接続する
導体パターン１０又は１０′を形成することを特
徴とする半導体パツケージ構造。[Claims for Utility Model Registration] A lid 4 made of ceramic and having the same dimensions as the frame 1 is bonded to the bottom of the frame 1 having the IC chip 3 etc. so as to seal the IC chip 3 etc., and the lower surface of the lid 4 is A semiconductor package structure characterized in that a lead 5 or 5' is attached and a conductive pattern 10 or 10' is formed inside the lid 4 to connect to the lead 5 or 5'.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15943288U JPH0281043U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15943288U JPH0281043U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281043U true JPH0281043U (en) | 1990-06-22 |
Family
ID=31440643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15943288U Pending JPH0281043U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281043U (en) |
-
1988
- 1988-12-09 JP JP15943288U patent/JPH0281043U/ja active Pending