JPH024261U - - Google Patents
Info
- Publication number
- JPH024261U JPH024261U JP8180388U JP8180388U JPH024261U JP H024261 U JPH024261 U JP H024261U JP 8180388 U JP8180388 U JP 8180388U JP 8180388 U JP8180388 U JP 8180388U JP H024261 U JPH024261 U JP H024261U
- Authority
- JP
- Japan
- Prior art keywords
- external leads
- plastic mold
- sealed
- featuring
- child
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のピギーバツク構造プラスチツ
クモールド封止ＩＣの一実施例の外観図、第２図
は応用例断面図、第３図は本考案のピギーバツク
構造プラスチツクモールド封止ＩＣの他の実施例
の外観図、第４図は従来のピギーバツク構造セラ
ミツクパツケージ封止ＩＣの断面図である。
１……プラスチツクモールド封止ＩＣ、２……
実装、回路接続用外部リード、３……子ＩＣ接続
用外部リード、４……子ＩＣ、５……子ＩＣの外
部リード、６……半田、７……セラミツク封止Ｉ
Ｃ、８……子ＩＣ接続用電極及び穴。
Fig. 1 is an external view of one embodiment of the piggyback structure plastic mold sealed IC of the present invention, Fig. 2 is a sectional view of an applied example, and Fig. 3 is another embodiment of the piggyback structure plastic mold sealed IC of the present invention. FIG. 4 is a sectional view of a conventional piggyback structure ceramic package sealed IC. 1...Plastic mold sealed IC, 2...
Mounting, external lead for circuit connection, 3...external lead for connecting child IC, 4...child IC, 5...external lead of child IC, 6...solder, 7...ceramic sealing I
C, 8...Electrode and hole for connecting the child IC.
Claims (1)
、一部の外部リードを他の外部リードとは反対方
向である該ＩＣの上表面上に配置するよう折曲げ
、かつ、該外部リードの先端部を他の部分より幅
広にした事を特徴とするプラスチツクモールドＩ
Ｃ。 In an IC sealed in a plastic mold, some external leads are bent so as to be placed on the upper surface of the IC in the opposite direction from other external leads, and the tips of the external leads are Plastic mold I featuring a wider width
C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180388U JPH024261U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180388U JPH024261U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024261U true JPH024261U (en) | 1990-01-11 |
Family
ID=31306573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8180388U Pending JPH024261U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024261U (en) |
-
1988
- 1988-06-20 JP JP8180388U patent/JPH024261U/ja active Pending