JPH0375539U - - Google Patents
Info
- Publication number
- JPH0375539U JPH0375539U JP13679589U JP13679589U JPH0375539U JP H0375539 U JPH0375539 U JP H0375539U JP 13679589 U JP13679589 U JP 13679589U JP 13679589 U JP13679589 U JP 13679589U JP H0375539 U JPH0375539 U JP H0375539U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- recess
- sealing resin
- resin
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案による半導体搭載用基板の概念
を示す上面図で、第２図は本考案による基板に半
導体チツプを搭載し樹脂封止したパツケージの断
面図である。また、第３図は従来の半導体搭載用
基板の概念を示す上面図で、第４図は従来の半導
体搭載用基板に半導体チツプを搭載し樹脂封止し
たパツケージの断面図である。
FIG. 1 is a top view showing the concept of a semiconductor mounting substrate according to the present invention, and FIG. 2 is a sectional view of a package in which a semiconductor chip is mounted on a substrate according to the present invention and sealed with resin. Further, FIG. 3 is a top view showing the concept of a conventional semiconductor mounting substrate, and FIG. 4 is a sectional view of a package in which a semiconductor chip is mounted on a conventional semiconductor mounting substrate and sealed with resin.
Claims (1)
チツプを搭載した後、凹部周辺のボンデイングパ
ツドを取り囲む位置に樹脂枠を貼りつけ封止樹脂
を注入してパツケージを形成する半導体搭載用基
板において、半導体封止樹脂及び樹脂枠の上に被
せたキヤツプによつて覆われる領域内の回路パタ
ーン厚みが３０〜１００μｍであることを特徴と
する半導体搭載用基板。 A semiconductor mounting board in which a recess is provided in a printed wiring board, a semiconductor chip is mounted in the recess, a resin frame is pasted around the recess at a position surrounding a bonding pad, and a sealing resin is injected to form a package. 1. A substrate for mounting a semiconductor, characterized in that a circuit pattern in a region covered by a semiconductor sealing resin and a cap placed on a resin frame has a thickness of 30 to 100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13679589U JPH0375539U (en) | 1989-11-28 | 1989-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13679589U JPH0375539U (en) | 1989-11-28 | 1989-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375539U true JPH0375539U (en) | 1991-07-29 |
Family
ID=31683984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13679589U Pending JPH0375539U (en) | 1989-11-28 | 1989-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375539U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008147077A (en) * | 2006-12-12 | 2008-06-26 | Matsushita Electric Ind Co Ltd | On-vehicle electronic device |
| JP2009110862A (en) * | 2007-10-31 | 2009-05-21 | Kenwood Corp | External connection connector holder of electronic device |
| JP2010050110A (en) * | 2009-12-01 | 2010-03-04 | Japan Aviation Electronics Industry Ltd | Connector |
-
1989
- 1989-11-28 JP JP13679589U patent/JPH0375539U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008147077A (en) * | 2006-12-12 | 2008-06-26 | Matsushita Electric Ind Co Ltd | On-vehicle electronic device |
| JP2009110862A (en) * | 2007-10-31 | 2009-05-21 | Kenwood Corp | External connection connector holder of electronic device |
| JP2010050110A (en) * | 2009-12-01 | 2010-03-04 | Japan Aviation Electronics Industry Ltd | Connector |
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